Metal microstructure formation method

A metal microstructure and microstructure technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of substrate deformation, residual stress of main metal, and inability to manufacture process.

Inactive Publication Date: 2012-07-18
PREMTEK INT
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0010] Yet the shortcoming of the U.S. Patent of above-mentioned US5,190,637 is: 1. Need to electroplate the second kind of metal again, if the area occupied by the second kind of metal is quite large, must reduce the residual stress that electroplating causes as far as possible, otherwise easy to use The substrate attached to the main metal is deformed, making it impossible to carry out the subsequent manufact

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Embodiment Construction

[0028] The implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it after studying this specification.

[0029] figure 1 It is a flowchart for illustrating the process steps of the metal microstructure forming method of the present invention. Such as figure 1 Shown in is the metal microstructure forming method of the present invention. Firstly, in step 11 , a substrate is prepared for subsequent metal microstructure formation on the substrate, and the process proceeds to step 12 .

[0030] In step 12, two or more layers of metal microstructures are successively formed on the surface of the substrate, where each layer of metal microstructures is composed of a material, and the two or more layers of metal microstructures can be made of the same material and / or consist of different materials, and go to step 13.

[0031] In step 13, liquid or reactive ion etch...

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Abstract

The invention discloses a metal microstructure formation method, which is applied to the manufacturing process of a microstructure assembly. By utilizing the metal microstructure formation method of the invention, the stereo metal microstructure of the microstructure assembly can be formed without electroplating a second metal for surrounding the periphery of the metal and without etching the second metal, so residual stress caused by the electroplating can be reduced, there is no residual stress between metal layers, and a baseboard adhered by the metal is not deformed, thereby subsequent manufacturing processes of the microstructure assembly are not influenced; and the etching of the second metal is not needed, so a problem that an etching liquid penetrates into each layer interface does not generate, and the adhesion of each layer does not decrease, thereby functions of the microstructure assembly are not influenced.

Description

[0001] This application is a divisional application of the application file with the application number 200910163069.5. The filing date of the original application is August 21, 2009, the application number is 200910163069.5, and the title of the invention is "Metal Microstructure Formation Method". technical field [0002] The invention relates to a method for forming a microstructure, in particular to a method for forming a metal microstructure, which is applied to the manufacturing process of microstructure components, can reduce the residual stress caused by electroplating, there will be no residual stress between metal layers, and the metal attached The substrate will not be deformed and will not affect the subsequent manufacturing process of the microstructure component. Background technique [0003] For the current MEMS technology, although MEMS has the advantages of miniaturization, batch production, and can provide many high-performance components, the goal it pursue...

Claims

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Application Information

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IPC IPC(8): G03F7/00C25D5/02
Inventor 王宏杰黄雅如
Owner PREMTEK INT
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