Exposure device and exposure method

An exposure device and exposure method technology, applied in the field of exposure, can solve problems such as low light transmittance, pattern cannot conform to pattern, and limit the performance of electronic products, so as to achieve the effect of improving performance and reducing pattern line distance

Active Publication Date: 2012-07-18
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

[0002] Photo-lithography technology (photo-lithography) has been widely used in the manufacturing process of various electronic products. Photo-lithography technology can be used to expose photoresist (PR) to form different patterns (pattern), but when the pattern of photoresist When the line space is small, the light transmittance is small, resulting in part of the photoresist not being exposed and connected together. Therefore, the pattern formed after photolithography cannot conform to the preset pattern, which greatly limits performance of electronic products

Method used

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  • Exposure device and exposure method
  • Exposure device and exposure method

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Embodiment Construction

[0024] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are for explaining and understanding the present invention, but not for limiting the present invention.

[0025] In the figures, structurally similar units are denoted by the same reference numerals.

[0026] Please refer to figure 1 , which shows a schematic diagram of an exposure apparatus according to a first embodiment of the present invention. The exposure device 100 of this embodiment is used for exposing the photoresist layer 102 on the transparent substrate 101 to pattern the photoresist layer 102 . Wherein, the transparent substrate 101 is, for examp...

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Abstract

The invention provides an exposure device and an exposure method. The exposure method includes that an exposure light source is used for supplying light to a photoresist layer, wherein the light penetrates through a photomask and a light transmitting base board to the photoresist layer; and a baffle-board is used for reflecting the light which penetrates through the photomask and the light transmitting base board back to the photoresist layer. The exposure device and the exposure method can reduce line distances of patterns of the photoresist layer.

Description

【Technical field】 [0001] The invention relates to the field of exposure technology, in particular to an exposure device and an exposure method. 【Background technique】 [0002] Photo-lithography technology (photo-lithography) has been widely used in the manufacturing process of various electronic products. Photo-lithography technology can be used to expose photoresist (PR) to form different patterns (pattern), but when the pattern of photoresist When the line space is small, the light transmittance is small, resulting in part of the photoresist not being exposed and connected together. Therefore, the pattern formed after photolithography cannot conform to the preset pattern, which greatly limits performance of electronic products. [0003] In particular, in many current electronic devices, such as liquid crystal display devices, it is necessary to continuously reduce the pitch of patterns to improve the performance of the electronic devices. [0004] Therefore, it is necess...

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/2008G03F7/20
Inventor 施明宏许哲豪薛景峰
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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