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Micro-electromechanical system (MEMS) microphone and packaging method thereof

A packaging method and microphone technology, which are applied to sensor parts, sensors, electrostatic transducer microphones, etc., can solve the problems of high production cost, poor reliability, and difficulty in implementation, and achieve low cost, low manufacturing cost, and reliable structure. good effect

Active Publication Date: 2012-07-18
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the packaging process of this structural design is complex and difficult to implement. The production costs of the two planar circuit boards and the circuit board frame are high, which does not meet the requirements of electronic products for reducing the cost of components, and is not conducive to the market promotion of MEMS microphones. The reliability of this product structure is also poor

Method used

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  • Micro-electromechanical system (MEMS) microphone and packaging method thereof
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  • Micro-electromechanical system (MEMS) microphone and packaging method thereof

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Experimental program
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Effect test

Embodiment 1

[0030] figure 1 It is a structural schematic diagram showing Embodiment 1 of the MEMS microphone according to the present invention.

[0031] Such as figure 1 As shown, the MEMS microphone related to the present invention includes a circuit board substrate 1, a circuit board frame 2 and a grooved cover 3 forming a MEMS microphone frame structure, wherein the circuit board frame 2 hollowed out in the middle and the grooved cover 3 are combined to form a MEMS microphone The slot-shaped shell, the circuit board substrate 1 and the slot-shaped cover 3 are respectively fixedly installed on the upper and lower surfaces of the circuit board frame 2, and the slot-shaped cover 3, the circuit board frame 2 and the circuit board substrate 1 are combined to form the cavity of the MEMS microphone structure.

[0032] Wherein, the trough-shaped cover 3 is made of metal.

[0033] The ASIC chip and the MEMS acoustic chip are respectively arranged on the circuit board substrate 1 and the tro...

Embodiment 2

[0043] figure 2 It is a structural schematic diagram showing Embodiment 2 of the MEMS microphone of the present invention.

[0044] On the basis of the first embodiment above, the present invention can also make the following figure 2 Another improvement shown in figure 2 In the MEMS microphone packaging structure shown, the circuit board substrate 1 is provided with a recess 11 for accommodating the metal wire 51 at a position close to the metal wire 51 . The setting of the recess 11 can facilitate the connection and fixation of the metal wire 51, so that the metal wire 51 will not be affected by the packaging of the circuit board substrate 1 and the circuit board frame 2, and reduce the product height of the MEMS microphone as a whole.

[0045] And, the ASIC chip 4 (or MEMS acoustic chip 5) that is arranged on the circuit board substrate 1 is arranged on the side of the circuit board substrate 1 away from the recess 11, so that it can ensure that the distribution is arr...

Embodiment 3

[0060] Figure 7 It is a structural schematic diagram showing Embodiment 3 of the MEMS microphone of the present invention.

[0061] On the basis of the first embodiment above, the present invention can also make the following Figure 7 Another improvement shown in Figure 7 Among them, the MEMS microphone includes a groove-shaped housing composed of a circuit board frame 2 hollowed out in the middle and a flat metal cover 3. One surface of the circuit board frame 2 is fixedly mounted on the cover 3, and the other surface is fixedly mounted on a circuit board. On the substrate 1, the cover 3, the circuit board frame 2 and the circuit board substrate 1 constitute the cavity structure of the MEMS microphone, the ASIC chip 4 is installed on the surface of the circuit board substrate 1 inside the cavity, and the cover 3 inside the cavity is installed on the surface The MEMS acoustic chip 5, the electrodes of the MEMS acoustic chip 5 are connected to the circuit board frame 2 thr...

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Abstract

The invention provides a micro-electromechanical system (MEMS) microphone and a packaging method of the MEMS microphone. The MEMS microphone comprises a circuit board substrate, a hollow circuit board frame, a cover, an MEMS acoustic chip and an application specific integrated circuit (ASIC) chip, wherein the circuit board substrate, the hollow circuit board frame and the cover form an MEMS microphone frame structure; the MEMS acoustic chip and the ASIC chip are arranged in the MEMS microphone frame structure; the circuit board substrate and the cover are fixedly arranged on the upper and lower surfaces of the circuit board frame respectively; the MEMS acoustic chip and the ASIC chip are arranged on the circuit board substrate and the cover respectively; and the chips on the cover are electrically connected with the circuit board frame through a metal wire. By the MEMS microphone and the packaging method of the MEMS microphone, the mounting positions of the MEMS acoustic chip and the ASIC chip of the MEMS microphone are flexibly regulated, and different design requirements can be met; and the MEMS microphone with the structure is low in manufacture cost and high in structural reliability.

Description

technical field [0001] The invention relates to the technical field of MEMS microphones, in particular to a structure of a MEMS microphone and a packaging method thereof. Background technique [0002] In recent years, MEMS microphones integrated with MEMS (micro-electromechanical systems) technology have begun to be applied in batches to electronic products such as mobile phones and notebooks. This kind of MEMS microphone has good high temperature resistance and can withstand the high temperature test of SMT technology. Favored by some microphone manufacturers. [0003] Commonly used MEMS microphone products generally use a circuit board and a housing to form a cavity to become the package of the MEMS microphone. On the outer surface of the circuit board, pads can be set to fix the MEMS microphone and electrically connect to the external circuit. A MEMS acoustic chip and an ASIC (Application Specific Integrated Circuit) chip are installed inside the cavity. In addition, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R3/00
Inventor 宋青林庞胜利谷芳辉
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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