Resin composition

A resin composition and resin technology, applied in layered products, metal layered products, glass/slag layered products, etc., can solve problems such as cracking and breaking of insulating layers, poor toughness, and separation

Active Publication Date: 2012-08-15
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such an epoxy resin composition is used to make a film and press it with a metal plate to form a metal substrate, the insulating layer of the metal substrate is often easily cracked and broken during the bending test and separated from the metal substrate
In addition, such resin compositions often have problems such as low glass transition temperature, poor toughness and insufficient peel strength.

Method used

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  • Resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Add 60g phenoxy resin, 70g bisphenol A epoxy resin, 30g Albiflex 296, 25g F-351, 800g spherical alumina, 0.12g TPP-K, 50g NMA, 30g OP 935 and 5g Elvax 40W, to prepare the main agent of epoxy resin that has been dispersed.

Embodiment 2

[0034] Add 60g thermoplastic acrylic resin, 70g bisphenol A epoxy resin, 30g DA323, 30g Albiflex 296, 25g F-351, 500g alumina, 300g silicon carbide, 0.12g TPP-K, 50g NMA into a 1000mL reaction bottle , 40g OP 935 and 10g Elvax 40W to prepare the dispersed epoxy resin main agent.

Embodiment 3

[0036] Add 60g PI-216 resin, 70g bisphenol A epoxy resin, 30g Albiflex XP 544, 25g F-351, 800g alumina, 200g boron nitride, 0.12g TPP-K, 50g NMA into a 1000mL reaction flask , 45g SPB-100 and 15g Elvax 40W to prepare the dispersed epoxy resin main agent.

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Abstract

A resin combination mainly comprises: (1) epoxy resin containing silicon atomic compounds; (2) thermoplastic resin; (3) organic elastic powder; (4) a hardener; (5) thermal-conductive inorganic fillers; (6) a phosphorus-containing burning resistant agent; (7) ethylene-vinyl acetate; (8) a catalyst.

Description

technical field [0001] The invention relates to a composition, in particular to a resin composition suitable for printed circuit boards. Background technique [0002] In the prior art, epoxy resin compositions generally consist of thermosetting epoxy resins, hardeners, and inorganic fillers. When such an epoxy resin composition is used to make a film and press it with a metal plate to form a metal substrate, the insulating layer of the metal substrate is often easily cracked and broken and separated from the metal substrate during the bending test. In addition, such resin compositions often have problems such as low glass transition temperature, poor toughness, and insufficient peel strength. [0003] Accordingly, there is a need to improve the traditional epoxy resin composition to meet the needs of the current industry. Contents of the invention [0004] Frustrated by the shortcomings of the known technology, the inventor exhausted his brains and minds to research and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L71/12C08L33/00C08L75/06C08L63/00C08L23/08C08L31/04B32B15/08B32B15/14B32B17/02B32B17/10H05K1/03
Inventor 谢镇宇
Owner ELITE MATERIAL
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