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TO247 lead frame

A technology of TO247 and lead frame, which is applied in the field of semiconductor device packaging, can solve the problems of reducing the poor performance of stress release and the inability to effectively control the void rate of products, so as to increase the bonding fastness of mounting, release internal stress, and resist external stress. Effect

Inactive Publication Date: 2012-08-15
江苏东晨电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a TO247 lead frame for the problem that the existing TO247 lead frame cannot effectively control the void rate of the product when mounting large-area chips, and has poor performance in reducing stress release after plastic packaging

Method used

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  • TO247 lead frame
  • TO247 lead frame
  • TO247 lead frame

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the drawings and embodiments.

[0019] Such as figure 1 As shown, a TO247 lead frame includes a heat sink 1 and three pins 3 connected below the heat sink 1. The upper area of ​​the heat sink 1 is the heat sink hole 6, and the lower area is the heat sink base. Island 2, the upper area of ​​the heat dissipation plate 1 is provided with a number of oblique second slots 5 symmetrically on both sides of the round hole 6 of the heat dissipation plate, and a number of first slots 4 are provided around and inside the base island 2 of the heat dissipation plate , The second slot 5 at the end connects the heat dissipation plate circular hole 6 and the first slot 4 on the upper periphery respectively, and the trajectory of each of the second slot 5 and the transverse track of the first slot 4 on the upper periphery Match at an angle of 30 to 35 degrees.

[0020] Chips are mounted in the base island 2 of the hea...

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Abstract

The invention discloses a TO247 lead frame comprising a cooling pad and three pins connected below the cooling pad, wherein a circular hole of the cooling pad is formed in the upper region of the cooling pad, a base island of the cooling pad is arranged in the lower region of the cooling pad, a plurality of second oblique clamp slots are symmetrically arranged on the two sides of the circular hole in the upper region of the cooling pad, a plurality of first clamp slots are arranged on the periphery and in the base island of the cooling pad, the second clamp slot on the end part is respectively connected with the circular hole of the cooling pad and the first clamp slot on the upper periphery of the base island, and the track of each second clamp slot is matched with the first clamp slot on the upper periphery of the base island with an angle of 30 degrees to 35 degrees. As the TO247 lead frame is provided with the clamp slots, cavities on the bottom of a chip are reduced with the existence of the first clamp slots after the chip is adhered, and the adhesion bonding fastness of the chip is improved; and as the second clamp slots are arranged outside the base island, the product can effectively resist external stress and release internal stress.

Description

Technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a lead frame specially used for large-area chip mounting, specifically a TO247 lead frame. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural component that realizes the electrical connection between the internal circuit lead end of the chip and the outer lead by means of the bonding alloy wire, and forms the key structure of the electrical circuit. It plays the role of a bridge connecting with the external wire. Lead frames are needed in most semiconductor integrated blocks, which are important basic materials in the electronic information industry. Product types include TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT, etc. Mainly use die stamping method and chemical etching method for production. [0003] The existing TO247 lead frame cannot effectively control the product void ratio when mounting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2924/0002H01L2924/00
Inventor 曾义
Owner 江苏东晨电子科技有限公司
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