Method for detecting interconnection wire full-open circuit defects by current difference values
A current difference and interconnection technology, applied in the field of failure response analysis of integrated circuits, can solve problems such as difficulty in distinguishing defective circuits from non-defective circuits, and achieve high accuracy, strong implementation, and high test resolution. Effect
Inactive Publication Date: 2014-08-13
JIMEI UNIV
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Problems solved by technology
In the context of such a large chip total static leakage current threshold, it becomes very difficult to distinguish defective circuits from non-defective circuits with a single static leakage current
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[0031] The invention firstly proposes the capacitance and current model of the fully open circuit defect of the deep submicron interconnection line, and then carries out SPICE transistor simulation for the fully open circuit defect of the interconnection line based on the capacitance and current model. After analyzing the simulation results, the specific program steps of measuring the full open defect of the interconnection line with the current difference are introduced.
[0032] One. Principle of the present invention
[0033] The present invention is described in further detail below in conjunction with accompanying drawing:
[0034] The invention detects the fully open-circuit defect of the interconnection line by measuring the current. But the present invention does not only utilize I DDQ Static leakage current, the proposed definition of current difference also does not refer to the difference between two static leakage currents, but refers to the difference between dy...
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The invention discloses a method for detecting interconnection wire full-open circuit defects by current difference values. The method comprises the following steps that: firstly, two special-form test patterns are generated by aiming at metal wires suspected to have open circuit defects; the two test patterns are sequentially loaded, and automatic test equipment (ATE) carries out current measurement in two specified time periods after the second test pattern loading; and if the current difference value of the twice measurement is greater than the magnitude order of a plurality of microamperes, the condition that the interconnection wire full-open circuit defects are generated can be judged. The method has the beneficial effects that the influence on the interconnection wire full-open circuit defects by a coupling capacitor in the deep sub-micron process is intensively considered, and the judgment on the open circuit is more accurate; the resolution ratio of the current difference test is higher than that of the single IDDQ test; the test realizability is high; and the extraction of the coupling capacitance value is not needed.
Description
Technical field: [0001] The invention belongs to the field of integrated circuits, and relates to a method for detecting fully open-circuit defects of interconnection lines by using current differences, in particular to an integrated circuit testability design, integrated circuit test, and integrated circuit failure response analysis method. Background technique: [0002] Existing testing techniques for completely open-circuit defects occurring on metal interconnect lines (that is: fully open-circuit defects of interconnect lines) have the following two things in common: [0003] (1) Existing technologies all use the method of measuring the voltage of the open circuit point to detect the full open circuit defect of the interconnection line. [0004] (2) The prior art considers that the voltage at the open circuit point is a constant value: a static fixed voltage type fault model is adopted, including a single stuck-at fault model (single stuck-at fault model), and a multiple...
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IPC IPC(8): G01R31/02G01R31/28G01R19/10
Inventor 韦素芬唐凯
Owner JIMEI UNIV