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Via structure integrated in electronic substrate

A technology of substrate and ring structure, applied in the direction of circuit, printed circuit, printed circuit, etc., can solve the problem of eddy current loss and other problems

Active Publication Date: 2012-09-05
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, eddy current losses remain problematic

Method used

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  • Via structure integrated in electronic substrate
  • Via structure integrated in electronic substrate
  • Via structure integrated in electronic substrate

Examples

Experimental program
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Embodiment Construction

[0033] see figure 1 In the illustrated embodiment, an electronic structure 102 is provided. The electronic structure 102 includes a substrate 104 in which a plurality of TSVs 106 are disposed. Although not shown, in various embodiments, a plurality of TSVs 106 may be arranged in the substrate as an array or cluster of TSVs. Substrate 104 may be made of a material such as silicon, silicon carbide, silicon dioxide, silicon nitride, or any other substrate material known to those skilled in the art. The substrate 104 may be a multilayer substrate, such as a build-up or laminated multilayer printed circuit board, or a build-up or laminated packaging substrate.

[0034] Each of the plurality of TSVs 106 includes a conductive layer 108 , an insulating or dielectric layer 110 , and a shielding layer 112 that may be in contact with the substrate 104 . An insulating or dielectric layer 110 is located between the conductive layer 108 and the shielding layer 112 . The insulating or di...

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Abstract

The invention discloses a system of via structures disposed in a substrate. The system includes a first via structure that comprises an outer conductive layer, an inner insulating layer, and an inner conductive layer disposed in the substrate. The outer conductive layer separates the inner insulating layer and the substrate and the inner insulating layer separates the inner conductive layer and the outer conductive layer. A first signal of a first complementary pair passes through the inner conductive layer and a second signal of the first complementary pair passes through the outer conductive layer. In different embodiments, a method of forming a via structure in an electronic substrate is provided.

Description

technical field [0001] The present invention relates generally to electronic substrates, and in particular to electronic substrates having via structures. Background technique [0002] Recent developments in packaging technology for integrated circuits have introduced through-silicon vias (TSVs), which are vertical electrical couplings through a silicon wafer or die. TSVs are important for forming 3D electrical packages so that conductive layers can be stacked on top of each other and signals can be passed between the conductive layers by utilizing TSVs. [0003] In conventional package designs, there may be an array or cluster of TSVs for passing signals between different conductive layers. In addition to occupying space in the substrate, TSVs may also affect the functionality of adjacent or neighboring TSVs. For example, mutual inductance between adjacent TSVs can cause crosstalk, which in some cases can negatively affect the operation of the electrical package. To redu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/66H01L23/498H01L23/48H01L23/64H05K1/02
CPCH01L23/14H01L23/49827H01L23/552H01L23/645H01L23/66H01L2223/6616H01L2223/6622H01L2223/6638H01L2924/3011H05K1/0222H05K1/0245H05K3/4602H05K3/4644H05K2201/09809H01L2924/0002Y10T29/49117H01L21/76898H01L23/481H01L2924/00H01L23/48H01L23/522
Inventor 李霞赵伟曹禺顾时群升·H·康金明初
Owner QUALCOMM INC