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Wafer container with adjustable inside diameter

A wafer container, wafer technology, applied in the direction of instruments, scientific instruments, semiconductor/solid-state device manufacturing, etc.

Active Publication Date: 2012-09-12
TEXCHEM ADVANCED PRODS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The patent requires additional inserts to provide cushioning, the cushioning is not incorporated or hinged with either shell

Method used

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  • Wafer container with adjustable inside diameter
  • Wafer container with adjustable inside diameter
  • Wafer container with adjustable inside diameter

Examples

Experimental program
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Embodiment Construction

[0021] figure 1 A perspective exploded view showing a wafer container with a plurality of wafers disposed between two wafer container clamshells. A plurality of semiconductor wafers 20 , 21 and 22 are shown separated by wafer dividers or spacer rings 25 between top 50 and bottom 100 enclosures. The top cover housing 50 has a flat top surface 105 . The inner base 102 extends to an outer base 103 where the bottom housing has a rib pattern 101 supporting the bottom of the lowermost semiconductor wafer 20 and adding to the structural strength of the relatively flat bases 102 and 103 . The top housing 50 and the bottom housing 100 have substantially flat rectangular or square bases. A plurality of internal rib walls 110 and 111 extending substantially vertically from bottom housing 100 protect semiconductor wafers 20-22 from moving sides. Ribs 115 rise from the outer edge of the bottom housing to provide an area for labeling the wafer carrier. In addition to the label area, the...

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PUM

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Abstract

Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and / or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.

Description

technical field [0001] The present invention relates to improvements in containers for semiconductor wafer transport. More specifically, the present wafer container includes improvements to clamp side walls that prevent wafer movement. Background technique [0002] During the processing of semiconductor wafers, typically the semiconductor wafers must be transported or transferred to other equipment between processing steps. Semiconductor wafers are fragile, and damage to the surface of the wafer can render the wafer unusable for its intended purpose. Because the potential risk of wafer damage is high, semiconductors must be packaged and shipped to minimize damage. During shipping, multiple semiconductor wafers are stacked in shipping containers. A number of container products have been marketed and related patents issued in an attempt to minimize damage to these silicon wafers. Exemplary examples of patents covering these products are disclosed here. [0003] US Patent ...

Claims

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Application Information

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IPC IPC(8): B65D85/86B65D85/38H01L21/673
CPCH01L21/67369H01L21/67373H01L21/67386B65D53/04B65D77/18B65D85/38G01N2223/6116H01L21/67353
Inventor J·D·彼兰特A·L·韦伯C·R·麦克
Owner TEXCHEM ADVANCED PRODS