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Optical element, optical element module, electronic element module, and electronic information device

A technology of optical components and electronic components, applied in the direction of optical components, optical, electrical components, etc., can solve problems such as ghosting and flare

Inactive Publication Date: 2012-09-19
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] There is a problem of ghosting and flare caused by stray light L that undergoes diffuse reflection on the cut surface and reaches the surface of the imaging element through the flat part

Method used

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  • Optical element, optical element module, electronic element module, and electronic information device
  • Optical element, optical element module, electronic element module, and electronic information device
  • Optical element, optical element module, electronic element module, and electronic information device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0090] figure 1is a perspective view for briefly describing a method of manufacturing a lens wafer module according to Embodiment 1 of the present invention. figure 1 (a) is a perspective view schematically showing two lens wafers and a light-shielding plate therebetween before lamination. figure 1 (b) is a perspective view schematically showing the lens wafer module after lamination.

[0091] Such as figure 1 As shown in (a), initially, two lens wafers 11 and 12 on the top and bottom are provided as an optical element wafer having a plurality of lenses arranged in a two-dimensional matrix pattern, and light shielding plates 13 are provided on the top and bottom Between the two lens wafers 11 and 12, openings therein for each lens are formed in a matrix pattern. Next, the positions of the lenses 11 a , 12 a and the opening 13 a are aligned such that the positions of the lenses 11 a and 12 a of the respective lens wafers 11 and 12 are aligned with the positions of the op...

Embodiment 2）

[0105] In Embodiment 1, the case of a wafer-level process, or specifically, the case of obtaining a plurality of lens modules 1 by cutting the lens wafer module 10 modularized using a plurality of lens wafers, was described. However, in Embodiment 2, the case of the injection molding process, specifically, the case of manufacturing a single lens by the injection molding process will be described.

[0106] Figure 5 (a) is a longitudinal sectional view schematically showing a lens manufactured by an injection molding process as an optical element of Example 2 of the present invention. Figure 5 (b) is Figure 5 (a) Rear view of the lens. Figure 6 (a) is used to describe Figure 5 (a) Longitudinal cross-sectional view of the lens fabrication method. Figure 6 (b) is Figure 6 (a) Rear view of the lens.

[0107] Such as Figure 5 As shown in (a) and 5(b), the lens 20 as the optical element of Embodiment 2 is formed by resin injection molding using a material such as a trans...

Embodiment 3）

[0111] In Embodiment 1, the lens module 1 is obtained by dicing the lens wafer module 10 manufactured by a wafer-level process. In Example 2, a lens 20 manufactured by an injection molding process was obtained. In Embodiment 3, an imaging module using the lens module 1 or the lens 20 according to Embodiments 1 and 2, respectively, will be described.

[0112] Figure 7 is a longitudinal sectional view schematically showing an imaging module according to Embodiment 3 of the present invention.

[0113] exist Figure 7 Among them, the imaging module 30 as the electronic component module of Embodiment 3 includes: a holder 31 as a dust cover; a lens holder 32 installed on the upper part of the holder 31; a condenser lens module accommodated in the lens holder 32 1 (or lens 20 ); substrate 33 ; solid-state imaging element 5 (sensor chip) as an electronic component, provided on substrate 33 and wire-bonded to substrate 33 ; IR cut filter 34 , fixed to a stepped portion inside holde...

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PUM

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Abstract

The present invention provides an optical element, comprising: a side surface where incident light undergoes diffuse reflection inside the optical element, between the outline of a top optical surface and a bottom optical surface; and an inclined surface for total reflection of diffuse reflection from the side surface, formed at least between the side surface and the bottom optical surface.

Description

[0001] This non-provisional application claims priority under 35 U.S.C §119(a) to Patent Application No. 2011-054837 filed in Japan on March 11, 2011, the entire contents of which are hereby incorporated by reference. technical field [0002] The present invention relates to: an optical element such as a lens; an optical element module cut from an optical element wafer module stacked from one or more optical element wafers having a plurality of lenses arranged in a two-dimensional pattern; Electronic component modules in which optical components or optical component modules are modularized using electronic components; and electronic information devices such as digital cameras (such as digital video cameras or digital still cameras), image input cameras, scanners, facsimile machines, personal digital assistants ( PDA), camera-equipped cellular phone devices, and video phone devices using the electronic component module in the imaging section. Background technique [0003] Fur...

Claims

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Application Information

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IPC IPC(8): G02B3/00H04N5/225
CPCG02B13/0085G02B27/0018H04N5/2254H04N5/2257H04N23/57H04N23/55
Inventor 矢野祐司栗本秀行广冈章吾
Owner SHARP KK
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