Structural modeling and structural optimization method for infrared area-array detector

Abstract

The invention relates to a structural modeling and structural optimization method for an infrared area-array detector. The method comprises the following steps of: firstly partitioning an infrared area-array detector structure model into two parts, namely a photosensitive element array region and a peripheral region, according to structural features of the infrared area-array detector; respectively setting material thermal expansion coefficients and analysis models of the photosensitive element array region and the peripheral region; and performing thermal-stress analysis and structural optimization on the a large area-array infrared detector based on the principle of equivalence by utilizing a small area array equivalent to the large area array, thus probably reducing the fragmentation probability of the detector and improving the rate of finished products. The method is applicable to the structural reliability design of an infrared area-array detector, has two effects of accurate modeling and rapid structural parameter optimization, solves the disadvantages of large occupied space in data storage, low speed of solving and the like during structural modeling and optimization of the large area-array infrared detector, and provides a new approach for analyzing the thermal stress of the large area-array infrared detector.

Description

technical field [0001] The invention relates to a structure modeling and structure optimization method of an infrared area array detector, which belongs to the field of optoelectronic technology. Background technique [0002] Infrared focal plane detectors have the advantages of high sensitivity, good environmental adaptability, strong anti-interference ability, light weight, low power consumption, etc., and are widely used in aerospace infrared remote sensing, national defense, meteorology, environment, medical and scientific instruments and other fields. Such as figure 1 As shown, the infrared focal plane detector usually uses the flip chip technology to interconnect the photosensitive element chip 1 and the silicon readout circuit 4 through the indium column array 2. The indium column not only provides the electrical connection between the photosensitive element chip and the input end of the silicon readout circuit, It also acts as a mechanical support. Afterwards, the ...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the time-consuming simulation calculation in the existing infrared focal plane detector structure modeling method cannot meet the needs of rapid structural optimization, and the model built by the simple equivalent method does not match the reality of the peripheral area of ​​the area array detector. Therefore, a structural modeling and structural optimization method for infrared area array detectors is proposed

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