LED (Light Emitting Diode) integrated packaging substrate with shortest bonding wire and light source module applying substrate

Abstract

The invention discloses an LED (Light Emitting Diode) integrated packaging substrate which comprises a substrate main body, common circuits arranged on the substrate main body, and a die bonding section arranged on the substrate main body. The die bonding section is divided into at least two integral areas, every two adjacent areas are mutually insulated and the electrodes of every two adjacent areas are opposite. The common circuits are an integral metal plate and are arranged in correspondence with the integral areas, and the common circuits are mutually insulated. One electrode lead of an LED chip is bonded in the die bonding area in which the LED chip is arranged and the other electrode lead is bonded in the die bonding area adjacent to the die bonding area in which the chip is arranged, and is connected with the common circuits. The two electrode leads of the LED chip can be bonded at the nearest sites at the corresponding areas, and in such a way, the bonding wire is the shortest.

Description

technical field [0001] The invention relates to the technical field of LED lighting and the field of LED packaging, in particular to an LED integrated packaging substrate with the shortest bonding wire and a light source module using the substrate. Background technique [0002] As a new type of light source, LED has the characteristics of environmental protection and energy saving, high brightness, long life, fast start-up speed, and high chroma. It is widely used in outdoor advertising displays, indoor lighting, decorative lights, and emergency lights. [0003] Since the 1990s, many breakthroughs have been made in the research and development of LED chip and material manufacturing technology, which has made epitaxial wafer and chip technology increasingly mature. At the same time, the improvement of LED chip efficiency and the expansion of LED application technology have also changed the existing LED packaging. Technology has transformed the mainstream LED packaging technol...

AI Technical Summary

Problems solved by technology

[0005] The circuit of the traditional LED integrated packaging substrate is generally formed by parallel matrix wiring or a combination of parallel wiring and oblique lines, such as figure 1 As shown, this routing method has limitations on the placement of the light source chip. Often, the entire light source will emit uneven light due to unreasonable placement of the chip, excessive light loss due to the placement of the chip, and excessive light loss due to the placement of the chip. If placed far away, the light will be blocked by too long bonding wires, the light will be damaged due to too long wires, or the circuit design will be difficult, difficult to process or difficult to pass safety inspections, etc.

[0006] The circuit of traditional LED integrated packaging substrates is generally composed of parallel symmetrical matrix wiring or a combination of parallel wiring and oblique lines. This wiring method has limitations on the structure of the chip. The chip is generally divided into horizontal structure and vertical structure. , when using traditional packaging substrates for integration and combination, if it is necessary to use vertical structure chips and horizontal structure chips for combined packaging at the same time, it will be difficult, because it cannot be realized due to the complicated wiring, or it cannot pass the safety inspection

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