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Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof

A leadless packaging technology with flat four sides. It is used in electrical components, electric solid state devices, semiconductor devices, etc., and can solve problems such as inability to meet product packaging, limited packaging technology expansion, and fewer pins.

Active Publication Date: 2012-09-26
TIANSHUI HUATIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the original QFN package has a single row of pins inside, so the number of pins is small. If it is 80 or less, it cannot meet the product packaging of more than 80 pins, which limits the expansion of packaging technology.

Method used

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  • Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof
  • Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof
  • Packaging part with double-row pins and four flat and pin-free surfaces and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 1. Thinning and scribing

[0044] Thinning thickness is 50μm, stack package, roughness Ra 0.10mm.

[0045] 8″ wafer thickness reduction: DR3000III / NITI0 for placement machine,

[0046] 8″ thinning machine: PG300RM / TSN. Thickness gauge DH151 / TSK;

[0047] 8″ dicing machine: Use a double-knife dicing machine, using anti-separation layer and anti-fragmentation process for scribing.

[0048] 2. Core loading

[0049] 8″ uses AD829 core loading machine;

[0050] Adhesive film is used as the bonding material, and the lead frame is a four-sided flat leadless frame with double rows of pins. ESPEC oven is used, and the nitrogen flow rate is (25-35) L / min.

[0051] 3. Pressure welding

[0052] ESEC3100 and Eagle60 bonding machines are selected, and gold wire is used as the welding wire material. Since the thickness of the package is 0.75, the pressure welding adopts the ultra-low-line arc pressure welding process, and the high-low arc positive and negative bonding method avoi...

Embodiment 2

[0064] 1. Thinning and scribing

[0065] Thinning thickness 200μm stacked package, roughness Ra 0.05mm,

[0066] 12″wafer thickness reduction: DR3000III / NITI0 for placement machine,

[0067] 12″ thinning machine: PG300RM / TSN. Thickness gauge DH151 / TSK,

[0068] 12″ dicing machine: WD300TXB, DR3000III / TSK for SMT,

[0069] Anti-separation layer, anti-shards process scribing.

[0070] 2. Core loading

[0071] 12″ choose DB-700FC / Jupei chip bonder.

[0072] Bonding material: Adhesive film or insulating glue is used, the lead frame is a four-sided flat leadless frame with double rows of pins, and an ESPEC oven is used, with a nitrogen flow rate of 25-35L / min.

[0073] 3. Pressure welding

[0074] Eagle60 bonding machine is used for pressure welding, copper wire is used for welding wire material, ultra-low arc pressure welding process is adopted for pressure welding, and high and low arc positive and negative welding methods are used to avoid wire crossing and broken wires. ...

Embodiment 3

[0087] 1. Thinning and scribing

[0088] According to the thickness of the packaged product, the thinning thickness is determined to be 150 μm, and the roughness is controlled at Ra 0.08mm.

[0089] Mounter with DR3000III / NITI0,

[0090] 6″wafer use: VG502MK II 8B.

[0091] Thinning machine: PG300RM / TSN. Thickness gauge DH151 / TSK;

[0092] 6″ slice dicing machine: DAD3350.

[0093] The scribing tool is selected according to the width of the scribing lane of the product, and the anti-separation layer and anti-fragmentation process are adopted.

[0094] 2. Core loading

[0095] Use AD89 core loading machine;

[0096] Bonding material: 8200 series materials are selected, and the lead frame is a four-sided flat lead-free frame with double rows of pins. The application adopts an ESPEC oven, and the nitrogen flow rate is (25-35) L / min.

[0097] 3. Pressure welding

[0098] Eagle60 bonding machine is used for pressure welding, and gold wire is used as the welding wire material...

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Abstract

The invention relates to a packaging part with double-row pins and four flat and pin-free surfaces and a production method thereof. The packaging part comprises a lead frame carrier, an IC chip, a bonding pad, inner lead pins, bonding lines and a plastic packaging body and is characterized in that the inner lead pins are arranged into two rows, i.e. the inner lead pin (4) and the inner lead pin (5), each pair of lead pins are connected together, a groove is arranged in the middle of the connected pins, the bonding pads are respectively connected with the inner lead pin (4) and the inner lead pin (5) through the bonding lines, an anti-spilling groove is arranged at the bottom of the carrier, and grooves are arranged at the bottoms of the inner lead pins. The packaging part is processed andproduced through the processes of reduction, scribing, chip installation, press welding, plastic packaging, electroplating, cutting and the like. The carrier is diminished, the inner lead pins are inwards extended and designed into double rows, and the packaged I / O number is increased, thereby not only markedly saving the cost of plastic packaging materials, but also realizing the thin and miniaturized packaging of portable products, being suitable for multi-pin high-density packaging, and improving the packaging density.

Description

technical field [0001] The invention relates to the technical field of manufacturing electronic information automation components, in particular to a four-sided flat leadless package with two rows of pins and a production method thereof. Background technique [0002] In recent years, the market for portable electronic devices in the field of mobile communications and mobile computers has exploded, directly promoting the development of small packaging and high-density assembly technologies. At the same time, a series of strict requirements are also put forward for small package technology, such as requiring the package size to be reduced as much as possible, especially the package height is less than 1mm; the reliability of the packaged product is improved as much as possible, in order to protect the environment and adapt to lead-free soldering, and Try to reduce costs. There are many miniaturized packaging structures, such as ball grid array BGA packaging, etc. However, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/48H01L23/495H01L21/50H01L21/60H01L21/56
CPCH01L2224/48247H01L2224/45147H01L2224/48245H01L2224/32245H01L2224/45144H01L2224/73265H01L2924/181
Inventor 郭小伟慕蔚
Owner TIANSHUI HUATIAN TECH
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