Indium-containing active copper-based solder

Abstract

The invention relates to an indium-containing active copper-based solder, which is particularly suitable for soldering copper and copper alloy workpieces of heat exchangers, various valve bodies and the like, can be widely applied to soldering of industries of refrigeration, machinery, electromechanics, electrical appliances and the like and belongs to an intermediate temperature soldering material. The indium-containing active copper-based solder comprises the following components in percentage by weight: 0.5 to 2.0 percent of Ag, 6.0 to 7.8 percent of P, 0.01 to 1.0 percent of In, 0.01 to 1.0 percent of Sb and the balance of Cu. The indium-containing active copper-based solder has the advantages of reasonable formula design, high cost performance, low solder melting temperature, high wettability, high fluidity, high soldered joint mechanical strength and high soldering process performance.

Description

technical field [0001] The invention relates to an active copper-based solder containing indium, which is especially suitable for brazing copper and copper alloy workpieces such as heat exchangers and various valve bodies, and can be widely used in brazing in industries such as refrigeration, machinery, electromechanical, and electrical appliances. Welding belongs to a medium temperature brazing material. Background technique [0002] For brazing between copper and copper alloys, considering the performance requirements for brazed joints, people need to choose copper-based brazing with high silver content such as BAg20CuP in the brazing process of some copper alloy parts with high requirements. material. However, as the price of non-ferrous metal raw materials continues to rise, especially the price of precious metal silver, manufacturers who use copper-based solder with high silver content for brazing are facing huge cost pressures. Under the fierce market competition, ent...

AI Technical Summary

Problems solved by technology

However, as the price of non-ferrous metal raw materials continues to rise, especially the price of precious metal silver, manufacturers who use copper-based solder with high silver content for brazing are facing huge cost pressures. Under the fierce market competition, enterprises have no choice but to Do not seek to reduce silver content in solder without compromising performance

[0003] At present, there are also some copper-based solders with less silver content, such as BCu89PAg copper-based solder containing 5% silver, BCu91PAg copper-based solder containing 2% silver, etc. Although these copper-based solders are relatively cheap, their melting temperature Higher, the brazing process performance and the mechanical strength of the brazed joint are not up to the use requirements, and the brazing performance in the welding of copper and copper alloys is not as good as BCu80PAg and BAg20CuP copper-based solder, which cannot meet customer requirements

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