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Electromagnetic shielding structure and manufacturing method thereof

A technology of electromagnetic shielding structure and manufacturing method, which is applied in the fields of magnetic field/electric field shielding, circuits, electrical components, etc., can solve the problems of large overall structure, increased production cost, uneven thickness, etc.

Active Publication Date: 2015-08-26
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the inhomogeneous thickness of the sputtering process method in the prior art, resulting in too large overall structure, or elongated process time, resulting in poor electromagnetic shielding effect and increased production costs. An electromagnetic shielding structure with uniform thickness and its manufacturing method

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  • Electromagnetic shielding structure and manufacturing method thereof
  • Electromagnetic shielding structure and manufacturing method thereof
  • Electromagnetic shielding structure and manufacturing method thereof

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Embodiment Construction

[0038] see figure 1 As shown, it is a schematic cross-sectional view of one embodiment of the electromagnetic shielding structure of the present invention. According to one embodiment of the electromagnetic shielding structure of the present invention, the electromagnetic shielding structure includes: a substrate 1 , at least one chip unit 2 , an encapsulation layer 3 and an electromagnetic shielding unit 4 .

[0039] The substrate 1 may be a circuit board, such as a flexible printed circuit board (FPCB) or a non-flexible printed circuit board. The chip unit 2 is disposed on the substrate 1 , and the chip unit 2 is electrically connected to the substrate 1 . The number of chip units 2 is not limited, and different numbers of chip units 2 are arranged on the substrate 1 according to product requirements. The encapsulation layer 3 is disposed on the substrate 1 and covers the chip unit 2 . The encapsulation layer 3 can be of different kinds of encapsulation materials, such as...

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Abstract

The invention discloses an electromagnetic shielding structure which comprises a substrate, at least one chip unit, a packaging layer and an electromagnetic shielding unit. The chip unit is arranged on a surface of the substrate and is electrically connected to the substrate, and the packaging layer is arranged on the substrate and covers the chip unit. The electromagnetic shielding unit comprises a first shielding clad layer, a second shielding clad layer and a third shielding clad layer. The first shielding clad layer covers an outer surface of the packaging layer and a side surface of the substrate, the second shielding clad layer covers an outer surface of the first shielding clad layer, and the third shielding clad layer covers an outer surface of the second shielding clad layer. According to the electromagnetic shielding structure, through a method of using sputtering and chemical electroless plating processes respectively, the bonding strength of clad layers can be raised, and the thickness of the electromagnetic shielding structure is homogenized. An electromagnetic shielding effect is raised and production cost is reduced.

Description

technical field [0001] The present invention relates to an electromagnetic shielding structure and a manufacturing method thereof, and in particular, to an electromagnetic shielding structure and a manufacturing method for improving the electromagnetic shielding efficiency. Background technique [0002] Electronic circuit components used in today's electronic products are required to have an EMI Shielding Structure. Its main purpose is to prevent the occurrence of electromagnetic interference between various circuit components. Among various electronic products, only with an excellent electromagnetic shielding structure can they operate stably and with high reliability, and are trusted and favored by users. Therefore, various fields such as computers, mobile phones, transportation vehicles, navigation systems, and household appliances all need to use related technologies of electromagnetic shielding structures. [0003] When the related art is used to fabricate the electro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCH01L2924/3025
Inventor 吴明哲
Owner UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO LTD