Insulation TO220AB power device based on aluminum radiating fin and production method
A technology of TO220AB and power devices, which is applied in the manufacture of electric solid state devices, semiconductor devices, semiconductor/solid state devices, etc., and can solve problems such as ineffective insulation and insufficient heat dissipation
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Embodiment 1
[0048] Such as figure 1 , 2 As shown, the insulated TO220AB power device based on an aluminum heat sink includes an independent power device, the power device includes a carrier 3, the upper surface of the carrier 3 is soldered with a chip 7 through a solder layer 6, and the chip is connected by a bonding wire 5 There are pins 2, a heat sink 8 is arranged under the carrier 3, there is a gap between the carrier and the heat sink 8, and the gap is filled with a plastic filling layer 4, and the carrier and the heat sink 8 The gap distance between them is between 0.3mm-0.8mm.
[0049] It also includes a plastic package 1 , the power device is plastic packaged inside the plastic package 1 , wherein the pins 2 pierce the plastic package 1 and extend into the plastic package 1 .
[0050] The lower surface of the slide 3 is connected with the filling layer 4 of the molding compound.
[0051] The lower surface of the carrier sheet 3 is flush with the side of the plastic package 1 c...
Embodiment 2
[0075] The difference between this embodiment and Embodiment 1 is that: the method for producing the above-mentioned power device is different: the production method of this embodiment is: the above-mentioned production method for the insulated TO220AB power device based on the aluminum heat sink, including the following steps:
[0076] Step A, assembling the power device: welding the above-mentioned chip on the carrier 3, and welding the above-mentioned pin 2 with the chip through the welding wire;
[0077] Step B, plastic sealing mold: including mold assembly step and compression molding step,
[0078] The mold assembly steps are:
[0079] Take the upper mold and the lower mold of the mold, place the heat sink 8 on the lower mold, and place the assembled power device above the heat sink 8;
[0080] Described stamping step is:
[0081] First take the above-mentioned 0.3mm-0.8mm thick plastic filling layer and place it on the upper surface of the heat sink 8, use the upper m...
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