Method for preparing fluorescent wafer for LED (light-emitting diode)

Abstract

The invention discloses a method for preparing a fluorescent wafer for an LED (light-emitting diode), which comprises the following steps of: (1) mixing; (2) molding; (3) isostatic pressing; (4) adhesive discharge and sintering; (5) polishing and grinding; and (6) scribing. After a fluorescent wafer is prepared by using the method for preparing a fluorescent wafer for an LED, disclosed by the invention, the fluorescent wafer can be directly covered on the surface of an LED chip; compared with the traditional adhesive dispensing process, by using the method, because a situation that the concentrations of fluorescent powder in silica gel or resin are nonuniform is eliminated, the improvement of the consistency of LED products is facilitated; a plane wafer prepared by using the method is better in outlet-light uniformity and flexibility, and the thickness of the fluorescent wafer is easy to control; and the method belongs to a planarizartion process, and is suitable for integrated large-scale production.

Description

technical field [0001] The LED light source of the present invention particularly relates to a preparation method of a fluorescent sheet covered on the surface of an LED wick. Background technique [0002] In recent years, whether it is inorganic or organic light-emitting devices (LED / OLED), white LED devices and their applications in lighting-related fields have received great attention from both academic and industrial circles. There are two main ways for white LEDs to produce white light: the first is to combine red, green and blue LED chips to produce white light; the second is to use LEDs to excite photo-induced conversion phosphors to form white light. A more mature method is to use blue LED chips with yellow phosphors (such as YAG: Ce3+, etc.) to achieve white light emission. [0003] For photoconverted white LEDs, the structure and characteristics of phosphor coatings have a crucial impact on the performance of white LEDs. The current process of preparing this type...

AI Technical Summary

Problems solved by technology

[0008] However, the above process has the following disadvantages: 1. The fluorescent powder mixture will be affected by the shape of the cup mouth of the bracket, resulting in a yellow or blue circle phenomenon, which affects the quality of light output; 2. The way of dispensing is to use gravity and other mechanical effects to mix the phosphor powder. After the liquid flows to wrap the LED chip, it is difficult to ensure the uniformity of the phosphor coating, which affects the uniformity of light emission; 3. The repeatability of the phosphor coating coated on the LED chip is poor, which greatly restricts mass production and Yield

Images