Eutectic machine and eutectic method
A eutectic solder and preheating technology, applied in the direction of electric heating devices, auxiliary devices, welding media, etc., can solve the problems of uncontrollable eutectic material fluidity and eutectic layer void ratio, so as to ensure reliability and improve product quality , enhance the flow effect
Active Publication Date: 2012-10-17
启东晟涵医疗科技有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to overcome the inability to control the fluidity of the eutectic material and the high void ratio of the eutectic layer in the prior art, and propose a new type of eutectic machine and eutectic method
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[0023] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:
[0024] Such as figure 1 and figure 2 As shown, the eutectic machine includes a feeding device, a conveying device, a preheating device 6, a heating device 7 and a receiving device; the preheating device 6 and the heating device 7 are arranged between the feeding device and the Between the discharge devices, the feeding device, the preheating device 6, the heating device 7 and the receiving device are connected through the conveying device; the heating device 7 is also provided with a vacuum sealing device, and the conveying device There are fixing devices on it. The vacuum device 4 keeps the welding environment in a vacuum state, thereby solving the problem of voids in the solder layer caused by air bubbles during the eutectic process, and effectively improving the flow of the eutectic solder.
[0025] Such as figure 1 As shown, in a preferred e...
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The invention provides an eutectic machine and an eutectic method, wherein the eutectic machine comprises a feeding device, a delivering device, a pre-heating device, a heating device and a material receiving device; the pre-heating device and the heating device are arranged between the feeding device and the discharging device; the feeding device, the pre-heating device, the heating device and the material receiving material are connected by the delivering device; a vacuum sealing device is arranged on the heating device; and a fixing device is arranged on the delivering device. The eutectic method comprises the steps of (1), placing eutectic solder on a substrate in a pointing manner, and placing a plurality of LED (light-emitting diode) chips at a preset position of the substrate; (2), pre-heating; and (3), heating and welding in vacuum. The eutectic machine and the eutectic method have the advantages: a problem of a cavity of a solder layer caused by bubbles in an eutectic process is solved, and the flow of the eutectic solder is favorable effectively; therefore, the reliability of the LED chips is ensured and the product quality is improved.
Description
【Technical field】 [0001] The invention relates to a eutectic machine and a eutectic method. 【Background technique】 [0002] In the prior art, the LED chip is generally fixed on the substrate by eutectic method. There are two main methods for fixing by eutectic method. When adopting the first method, first apply creamy eutectic solder on the substrate, and then Place the LED chip on the corresponding position of the substrate, and then heat the substrate. After the solder dissolves, the LED chip can be welded on the substrate; another welding method for eutectic is to heat the substrate to the melting point of the solid solder, and then Solder is melted on the substrate, and finally the LED chip is placed on the substrate for soldering; in addition, in a few cases, the eutectic solder is pre-plated on the chip, and then the entire chip is directly heated to the melting point of the solder and placed on the substrate. . [0003] None of the above existing eutectic technologi...
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Login to View More IPC IPC(8): B23K3/00B23K3/04B23K3/08B23K1/00B23K35/24
Inventor 杨勇平何永基
Owner 启东晟涵医疗科技有限公司