Technology for producing AAQFN framework product quad flat package on basis of sand blasting

A manufacturing process and flat packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems affecting product service and life, achieve low cost, reduce the probability of delamination, and improve The effect of product reliability

Inactive Publication Date: 2012-10-17
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005]However, due to limitations such as technical difficulties, it is currently difficult to promote AAQFN products in the market, especially in terms of reliability, which directly affects the use and life of products. Become the technical difficulty of AAQFN package

Method used

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  • Technology for producing AAQFN framework product quad flat package on basis of sand blasting
  • Technology for producing AAQFN framework product quad flat package on basis of sand blasting
  • Technology for producing AAQFN framework product quad flat package on basis of sand blasting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:

[0028] The first step, wafer thinning; wafer thinning thickness is 50μm, roughness Ra 0.10um;

[0029] The second step is to use a double-knife scribing machine and its process for scribing;

[0030] The third step is to use adhesive film to glue the core;

[0031] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;

[0032] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;

[0033] The sixth step is post-curing in the same way as the conventional AAQFN process;

[0034] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the frame;

...

Embodiment 2

[0038] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:

[0039] In the first step, the thinning thickness of the wafer is 130μm, and the roughness Ra is 0.20um;

[0040] The second step is to use a double-knife scribing machine and its process for scribing;

[0041] The third step is to use the film (DAF) on the core;

[0042] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;

[0043] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;

[0044] The sixth step is post-curing in the same way as the conventional AAQFN process;

[0045] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the fra...

Embodiment 3

[0049] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:

[0050] In the first step, the wafer thinning thickness is 200μm, and the roughness Ra is 0.30um;

[0051] The second step is to use the ordinary QFN scribing process for scribing;

[0052] The third step is to use the film (DAF) on the core;

[0053] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;

[0054] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;

[0055] The sixth step is post-curing in the same way as the conventional AAQFN process;

[0056] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the frame;

[0057] The eig...

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Abstract

The invention relates to a technology for producing an AAQFN framework product quad flat package on the basis of sand blasting, which belongs to the technical field of integrated circuit package. After groove is formed in a framework in a corrosion manner, a method of blasting sand before brushing green paint is adopted to form an effective dragging prevention structure among the framework, the primary plastic package material and the green paint, so the condition that layering is easily caused by the low integration degree of the plastic package material and the framework due to the flat and smooth framework after the traditional stamping framework is filled with the plastic package material during the plastic package process is avoided, the occurrence probability of the package layering condition is greatly reduced, the product reliability is tremendously improved, and the product has a better plastic package effect than the traditional AQQFN product; and moreover, the technology is simple, convenient and low in cost.

Description

technical field [0001] The invention relates to an improved process in the plastic sealing process of a flat package, in particular to a process for manufacturing a flat package of an AAQFN frame product based on sandblasting, and belongs to the technical field of integrated circuit packaging. Background technique [0002] Integrated circuits are the core of the information industry and high-tech, and the foundation of economic development. Integrated circuit packaging is the main component of the integrated circuit industry, and its development has been accompanied by the increase in its functions and device count. Since the 1990s, it has entered the development track of multi-pin count, narrow pitch, and miniaturization. Carrierless grid array package (AAQFN) is a new packaging form born to adapt to the rapid development of electronic products, and it is an indispensable product for the realization of miniaturization, light weight and networking of electronic machines. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56
CPCH01L2224/48091H01L2224/73265H01L2224/92247H01L2924/181H01L2924/00014H01L2924/00012
Inventor 罗育光郭小伟崔梦刘建军刘卫东
Owner HUATIAN TECH XIAN
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