Technology for producing AAQFN framework product quad flat package on basis of sand blasting
A manufacturing process and flat packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems affecting product service and life, achieve low cost, reduce the probability of delamination, and improve The effect of product reliability
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Embodiment 1
[0027] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:
[0028] The first step, wafer thinning; wafer thinning thickness is 50μm, roughness Ra 0.10um;
[0029] The second step is to use a double-knife scribing machine and its process for scribing;
[0030] The third step is to use adhesive film to glue the core;
[0031] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;
[0032] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;
[0033] The sixth step is post-curing in the same way as the conventional AAQFN process;
[0034] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the frame;
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Embodiment 2
[0038] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:
[0039] In the first step, the thinning thickness of the wafer is 130μm, and the roughness Ra is 0.20um;
[0040] The second step is to use a double-knife scribing machine and its process for scribing;
[0041] The third step is to use the film (DAF) on the core;
[0042] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;
[0043] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;
[0044] The sixth step is post-curing in the same way as the conventional AAQFN process;
[0045] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the fra...
Embodiment 3
[0049] Firstly, grooves are formed on the frame by corrosion, and then filled by sandblasting and then green paint. The specific manufacturing process is carried out as follows:
[0050] In the first step, the wafer thinning thickness is 200μm, and the roughness Ra is 0.30um;
[0051] The second step is to use the ordinary QFN scribing process for scribing;
[0052] The third step is to use the film (DAF) on the core;
[0053] The fourth step is to use the same method as the conventional AAQFN process for pressure welding;
[0054] The fifth step is to carry out a plastic sealing with traditional plastic sealing compound;
[0055] The sixth step is post-curing in the same way as the conventional AAQFN process;
[0056] The seventh step is to etch the groove on the back of the frame; use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half of the thickness of the frame;
[0057] The eig...
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