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Three-layer anti-counterfeit label pcb board and its preparation process

A technology for PCB boards and anti-counterfeiting labels, which is applied to printed circuits connected with non-printed electrical components, printed circuits assembled with electrical components, etc. It can solve the problem that surface treatment cannot be gold-plated, cannot be fixed accurately, and three-layer boards cannot Accuracy and other issues to achieve the effect of reducing costs

Active Publication Date: 2016-06-22
KUSN HUACHEN ELECTRONICS
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AI Technical Summary

Problems solved by technology

[0002] At present, the core technology of anti-counterfeiting labels is mainly chip binding, so the chip binding position is required to be very precise, while the traditional three-layer board cannot meet the required accuracy and cannot be fixed accurately
In addition, the traditional process of manufacturing three-layer PCB boards, due to the formation of 0.3mm deep pits between the pads and the board surface, the surface treatment (chemical gold plating) process cannot be partially gold-plated

Method used

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  • Three-layer anti-counterfeit label pcb board and its preparation process

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Embodiment Construction

[0022] A three-layer anti-counterfeiting label PCB board, which includes a light board 1 and a core board 2 arranged in parallel to each other, ink and lines are printed on both sides of the core board, and a parallel arrangement is also arranged between the light board and the core board. There is an insulating layer 3 .

[0023] The insulating layer is made of epoxy glass cloth material.

[0024] The light board is made of glass fiber material.

[0025] A preparation process for a three-layer anti-counterfeit label PCB board, which comprises the following steps:

[0026] ① Core board cutting, that is, cutting the substrate into a core board of a set size according to needs;

[0027] ② Drill and hole the core board;

[0028] ③ Set up lines on both sides of the core board;

[0029] ④Electroplating the core board, that is, copper-plating the entire core board;

[0030] ⑤ Etching the core board, that is, displaying the circuit diagram required on the surface of the core boa...

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Abstract

The invention discloses a three-layer anti-fake label PCB plate and a preparation process thereof. The PCB plate includes a light panel and a core plate which are arranged in a mutually parallel way. Surfaces of two sides of the core plate are printed with ink and a line respectively. An insulation layer is parallelly arranged between the light panel and the core plate. The preparation process can satisfy an accuracy requirement of a chip binding position, overall gilding is available for surface processing, the core plate is added with a resistance welding ink coating layer, and cost of the surface processing (chemical gilding) can be greatly reduced.

Description

technical field [0001] The invention relates to a PCB board, in particular to a three-layer anti-counterfeiting label PCB board and a preparation process thereof. Background technique [0002] At present, the core technology of the anti-counterfeiting label is mainly chip bonding, so the chip bonding position is required to be very precise, while the traditional three-layer board cannot meet the required accuracy and cannot be fixed precisely. In addition, the traditional process of manufacturing three-layer PCB boards, due to the formation of 0.3mm deep pits between the pads and the board surface, the surface treatment (chemical gold plating) process cannot be partially gold-plated. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a three-layer anti-counterfeit label PCB board and its preparation process. This process can not only meet the accuracy requirements of the chip binding position, but also the su...

Claims

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Application Information

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IPC IPC(8): H05K1/18H05K3/34
Inventor 孟文明
Owner KUSN HUACHEN ELECTRONICS
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