Sealing pad machining method
A processing method and sealing tile technology, which are applied in the processing field of sealing tiles, can solve the problems of low processing precision of sealing tiles, and achieve the effects of reducing deformation, ensuring processing precision and optimizing process plan.
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specific Embodiment approach 1
[0018] Specific implementation mode one: combine Figure 1-Figure 3 Describe this embodiment, the concrete steps of a kind of sealing tile processing method of this embodiment are:
[0019] Step 1. Mill the mid-section surface of the upper half-seal tile 1-1 and the mid-section surface of the lower half-seal tile 1-2 to be flat, and the processing amount is ≤1.5mm;
[0020] Step 2. Roughly turn the inner arc, outer arc and two planes of the upper half sealing tile 1-1 and the lower half sealing tile 1-2. 1mm, the cutting parameters are: the speed is 58-62r / min, the feed rate is 0.2-0.4mm / r, and the cutting depth is 1.5mm;
[0021] Step 3: Perform stress-relief treatment on the upper half-sealed tile 1-1 and the lower half-sealed tile 1-2 respectively. The specific process of stress-relief treatment is as follows: first heat to 500°C-650°C for 2-3 hours, then Keep warm for 2 hours, and finally cool slowly with the furnace to 200°C-300°C, and the cooling time is 10-12 hours; ...
specific Embodiment approach 2
[0030] Embodiment 2: The cutting parameters in step 2 of this embodiment are: the rotational speed is 60 r / min, and the feed rate is 0.3 mm / r. Others are the same as in the first embodiment.
specific Embodiment approach 3
[0031] Specific embodiment three: the specific process of stress relief treatment in step three of this embodiment is: firstly heat to 550°C, heating time is 2.5 hours, then keep warm for 2 hours, and finally cool slowly to 280°C with the furnace, cooling time is 11 hours . Others are the same as in the first or second embodiment.
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