Inorganic light insulating mortar composite XPS (Extruded Polystyrene) insulating board and preparation method thereof
A technology of thermal insulation mortar and thermal insulation mortar layer, which is applied in the field of building thermal insulation materials, can solve the problems of convenience, property loss, casualties, etc., and achieve the effects of enhancing flexural strength, improving occlusal degree, and ensuring uniformity
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Embodiment 1
[0037] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 2 As shown; it includes an XPS substrate 3 with grooves 1 and 2 on the front and back sides, an interface agent layer 4, and an inorganic lightweight thermal insulation mortar layer; the interface agent layer 4 is arranged on the XPS substrate 3, and the inorganic lightweight thermal insulation mortar layer The mortar layer is arranged on the interface agent layer 4 . The inorganic lightweight thermal insulation mortar layer is an inorganic lightweight thermal insulation mortar layer of composite grid cloth, specifically including an inorganic lightweight thermal insulation mortar filling layer 5, an intermediate alkali-resistant coating grid cloth layer 6 and an inorganic lightweight thermal insulation mortar coating Layer 7; the interface agent layer 4 in the grooves 1 and 2 of the XPS substrate 3 is filled with an inorganic lightweight th...
Embodiment 2
[0051] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 3 Shown; Its structure is basically the same as embodiment 1, and difference is:
[0052] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back sides is specifically: the front and back sides of the XPS substrate 3 are respectively provided with a number of continuous longitudinal V-shaped grooves 1 (the depth is 5mm±0.2mm, the width is 5mm± 0.2mm), perpendicular to the direction of the V-shaped groove 1, U-shaped grooves 2 with a spacing of 400mm (the depth is 10mm±0.2mm, and the width is 10mm±0.2mm); The grooves 1 correspond to the peaks and valleys, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of 40 mm.
[0053] The preparation method of the inorganic lightweight thermal insulation mortar composite XPS thermal insulatio...
Embodiment 3
[0064] Inorganic lightweight thermal insulation mortar composite XPS thermal insulation board of the present embodiment is as figure 1 , 4 Shown; Its structure is basically the same as embodiment 1, and difference is:
[0065] In this embodiment, the XPS substrate 3 with grooves 1 and 2 on the front and back sides is specifically: the front and back sides of the XPS substrate 3 are respectively provided with a number of continuous V-shaped grooves 1 at an oblique angle of 45 degrees (the depth is 5 mm ± 0.2 mm, The width is 5mm±0.2mm), and the U-shaped groove 2 with a distance of 440mm is arranged perpendicular to the direction of the V-shaped groove 1 (the depth is 10mm±0.2mm, and the width is 10mm±0.2mm); the front and back of the XPS substrate 3 The peaks and valleys of the V-shaped grooves 1 correspond to each other, and the U-shaped grooves 2 are equidistant from each other. This XPS substrate 3 is a B1 grade XPS substrate with an average thickness of 35 mm.
[0066] T...
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