cob module and its manufacturing method

Abstract

The invention discloses a COB module and a manufacturing method thereof. The COB module includes: a chip; UV-curable glue; a substrate, including a substrate and a metal pattern, wherein the chip is mounted on the substrate of the substrate through the UV-curable glue, and the metal pattern is arranged on the surface of the substrate and forms a conduction function, the substrate can transmit ultraviolet light, and when the COB module is observed from the other side of the substrate opposite to the side where the chip is placed, at least a part of the ultraviolet curable glue can pass through the gap of the metal pattern exposed. The ultraviolet light source is arranged on the other side of the substrate of the COB module opposite to the side where the chip is arranged, and the ultraviolet light is irradiated on the ultraviolet curable adhesive through the gap of the metal pattern to cure the ultraviolet curable adhesive. After adopting the COB structure and manufacturing method of the present invention, the curing temperature and curing time of the chip mounting glue are reduced, and the temperature-sensitive chips and substrates are not damaged.

Description

technical field [0001] The invention relates to a COB module and a manufacturing method thereof, in particular to a COB module using ultraviolet curing glue and a manufacturing method thereof. Background technique [0002] The chip on board (ChipOnBoard, COB) packaging process first covers the chip placement point on the surface of the substrate (for example, a printed circuit board) with a thermally conductive epoxy resin (generally epoxy resin doped with silver particles), and then directly places the chip ( Mounting) on ​​the surface of the substrate, heat treatment until the chip is firmly fixed on the substrate, and then use wire bonding to directly establish an electrical connection between the chip and the substrate, and cover it with resin to ensure reliability. COB is the simplest bare chip mounting technology. Compared with other packaging technologies, COB technology is cheap (only about 1 / 3 of the same chip), saves space, and has a mature process. [0003] Figu...

AI Technical Summary

Problems solved by technology

However, it can be seen from Table 1 that when heat-curing glue is used as the die-attach glue, the heat received by the heat-curing step of the die-attach glue will be very large, which is much larger than the heat accepted by other steps, which will affect the Damage or adverse effects on temperature-sensitive chips and substrates

For example, if a chip with a tiny temperature sensor is cured at high temperature, it will cause damage to the temperature sensing device on the chip

Another example is the plastic substrate with a low melting point. High temperature will also cause the plastic substrate to be deformed by heat and cause damage.

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