Addition solidifying type organosilicone composition and photosemiconductor apparatus using the same

An addition curing silicone technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of curing resistance and unusability of addition curing silicone sealing materials, and achieve excellent ejection and light Excellent reflectivity and excellent shape stability

Active Publication Date: 2012-10-31
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a long curing time from half a day to several days and a curing agent for crosslinking it cannot be used because of curing hindrance to the crosslinking of the addition curing type silicone sealing material

Method used

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  • Addition solidifying type organosilicone composition and photosemiconductor apparatus using the same
  • Addition solidifying type organosilicone composition and photosemiconductor apparatus using the same
  • Addition solidifying type organosilicone composition and photosemiconductor apparatus using the same

Examples

Experimental program
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Embodiment 1～3、 comparative example 1～4

[0088] The components shown below were uniformly mixed with the universal mixing mixer (Shinagawa mixer) manufactured by Dalton Co., Ltd. in accordance with the compounding amount shown in Table 1 to prepare a silicone composition.

[0089] [A] Organopolysiloxane with two vinyl groups directly bonded to silicon atoms in one molecule and a viscosity of 10,000 mPa·s (25°C with vinyl groups directly bonded to silicon atoms at both ends of the molecule 80 parts by mass of organopolysiloxane with a viscosity of 5,000 mPa·s and Me 3 SiO 1 / 2 , ViMe 2 SiO 1 / 2 (Me represents a methyl group, Vi represents a vinyl group. The same applies below.) and SiO 4 / 2 Unit composition, relative to SiO 4 / 2 , Me 3 SiO 1 / 2 And ViMe 2 SiO 1 / 2 The molar ratio of is 0.8, and the amount of vinyl relative to the solid content is 0.085 mol / 100g of a mixture of 20 parts by mass of silicone resin)

[0090] [B-1] The following formula has a trimethoxysilyl ethyl group directly bonded to a silicon atom at one end of ...

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Abstract

The invention provides an addition solidifying type organosilicone composition having proper viscosity (ejecting property), nonliquidity (shape stability when being heated for solidification), and excellent optical reflection, and a photosemiconductor apparatus using the same. The addition solidifying organosilicone composition is particularly applicable to the reflecting material of the LED with self-adhesiveness. The self-adhesiveness addition solidifying type organosilicone composition applicable to photosemiconductor apparatus comprises the following procedures: (A) one molecule comprises at least two organopolysiloxanes of alkenyl bonded with the silicon atom, 100 parts by mass; (B) one molecule comprises at least two hydrogen atoms bonded with silicon atoms and at least one organic polysiloxane of the alkoxy, with the general Si-H-yl number being 1.4-5.0 times of the general alkene-yl number of the component (A); (C) fumed silica, relative to 100 parts by mass of the components (A) and (B), has 8 to 30 parts by mass; (D) white pigment; and (E) solidifying catalyst.

Description

Technical field [0001] The present invention relates to a self-adhesive additive that has appropriate viscosity (dischargeability), non-fluidity (shape stability during heat curing) and excellent light reflectivity, especially for light reflective materials for LEDs. Into a curable silicone composition and an optical semiconductor device using it. Background technique [0002] In recent years, attempts have been made to use LEDs in notebook computers and LCD TVs. In order to evenly illuminate the large screen, it is achieved by arranging many side-view LEDs or top-view LEDs. In this regard, there is also a method of forming a sealing material in a dome shape on a circuit board on which an LED chip and wiring are connected to a board called a map board. The molding of the sealing material only needs to drop a few drops of liquid silicone to heat and cure, but there is a problem that effective sealing cannot be achieved because the viscosity decreases and spreads until the curing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/06C08K3/36H01L33/56
Inventor 山川直树小材利之木村真司
Owner SHIN ETSU CHEM IND CO LTD
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