Semiconductor packaging method for forming two-sided electromagnetic shielding layer as well as construction thereof

Abstract

The invention discloses a semiconductor packaging method for forming a two-sided electromagnetic shielding layer, which is characterized in that a baseplate does not require a special grounding structure, or scribe line plated-through-holes are not required to be thickened, and grounding connection of the electromagnetic shielding layers is manufactured easily. Firstly, a baseplate master slice is provided, and alignment marks for grounding connection are arranged at the corners of baseplate units. After the steps of die bonding and die molding, multiple semi-cut slots are formed in the lower surface of the baseplate master slice and along the scribe lines, and penetrate the baseplate master slice. A first electromagnetic shielding layer is patterned and formed on the lower surface of the baseplate master slice, covers and is connected to the alignment marks, and is further formed in the semi-cut slots. After monomerization cutting of die molding bodies, a second electromagnetic shielding layer is formed on the top surfaces and the cut side surfaces of the die molding bodies, and is further connected to the first electromagnetic shielding layer.

Description

technical field [0001] The present invention relates to the packaging technology of semiconductor devices, in particular to a semiconductor packaging method and structure for forming double-sided electromagnetic shielding layers. Background technique [0002] A semiconductor chip is a tiny electronic component. Even after being packaged, it may still be subject to electromagnetic interference (EMI), which may cause chip operation abnormality or electrical function failure. Especially, the higher the operation frequency of the chip, the more susceptible it is to interference. Therefore, according to one of the known conventional methods, an electromagnetic shielding layer (or a radio frequency shielding layer) is covered on the outer surface of the encapsulant in which the chips are sealed. However, the electromagnetic shield must be effectively connected to ground in order to exert a good shielding effect. In addition, the encapsulant itself is an electrical insulating mate...

AI Technical Summary

Problems solved by technology

Before forming the electromagnetic shielding layer 152, a half-cut step must be performed, which cuts through the sealant 130 from above along the cutting line 114 until removing a part of the plated through holes 117, and the half-cut groove 140 formed The depth exceeds the thickness of the sealing body 130, which is about two-thirds of the overall thickness, and a part of the mother substrate 110 is also cut off, resulting in insufficient carrying capacity of the mother substrate 110

In addition, the thickness of the base substrate 110 should be increased, approximately greater than the thickness of the encapsulant 130, so as to provide sufficient half-cut exposed areas of the plated through holes 117, otherwise the plated through holes 117 may not be successfully shielded electromagnetically. Layer 152 Covering Connections

Therefore, the existing electromagnetic shielding layer 152 is a single-sided covering type, and the mother substrate must be designed with a special ground connection structure and must have a thickness that can provide sufficient support strength after half-cutting

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