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Lid, fabricating method thereof, and mems package made thereby

A technology of conductor layer and carrier plate, which is applied in the direction of transportation and packaging, measuring devices, electric solid devices, etc., can solve the problem of the decrease of the shielding effect of the side surface of the capacitive microphone, and achieve the effect of enhancing the shielding effect

Inactive Publication Date: 2012-10-31
UNIMICRON TECH CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive adhesive layer 13 and the conductive plate 11 are different in constitution from each other, thus reducing the shielding effect of the side surface of the condenser microphone.

Method used

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  • Lid, fabricating method thereof, and mems package made thereby
  • Lid, fabricating method thereof, and mems package made thereby
  • Lid, fabricating method thereof, and mems package made thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] refer to Figure 2A , providing a first plate 20 having opposing first and second surfaces 20a, 20b. Two initial metal layers 211 are formed on the first and second surfaces 20a and 20b. However, the initial metal layer 211 is formed on the second surface 20b of the first plate 20 on an optional basis.

[0016] refer to Figure 2B , roughen and thin the initial metal layer 211 on the first surface and the second surface 20a, 20b by etching process so as to form the first metal layer 21a from the initial metal layer 211 on the first surface 20a, and form the first metal layer 21a from the second surface The initial metal layer 211 on 20b forms a second metal layer 21b as another metal layer.

[0017] refer to Figure 2C with Figure 2D , the adhesive layer 22 as a non-conductive layer such as Figure 2C is formed on the second metal layer 21b as shown in Figure 2D A via cavity 200 is formed through the first metal layer 21 a , the first plate 20 , the second meta...

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Abstract

A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board (20) with opposite first and second surfaces (20a, 20b) having first and second metal layers (21a, 21b) disposed thereon, respectively, wherein a through cavity (200) extends through the first board and the first and second metal layers; a second board (23) with opposite third and fourth surfaces (23a, 23b); an adhesive layer (22) sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess (200); and a first conductor layer (25a) coating the bottom and the side surfaces (201a, 201b) of the recess. The lid enhances the shielding effect upon the MEMS device.

Description

technical field [0001] The present invention relates to a cover, its manufacturing method and the MEMS (micro-electromechanical system) package made therefrom, and more particularly to a cover with a metallized recess, its manufacturing method and the MEMS-enabled package made therefrom. Enhanced shielding effect of the MEMS package. Background technique [0002] MEMS devices, such as microphones, are widely used in mobile communication devices, audio devices, and the like. To achieve miniaturization, microphones for use as hearing aid units, commonly called condenser microphones, are reduced in size. However, the transducers therein are fragile and susceptible to physical damage. In addition, the transducer must be protected from light and electromagnetic interference since the environment can disturb signal transmission. Additionally, as far as protection from light and electromagnetic interference is concerned, favorable sound pressure is required for the transducer to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00H10N39/00
CPCH01L2224/48091B81C2203/0118H01L2224/73265B81B7/0064H01L2224/48227H01L2224/48137H01L2224/32225H01L2224/48228H01L2924/3025H04R19/005B81B2201/0257H01L2924/1461H01L24/73Y10T428/24562Y10T156/1056H01L2924/00012H01L2924/00014H01L2924/00
Inventor M·F·科特斯M·A·阿佐帕尔迪许诗滨蔡琨辰I·米尔莱夫
Owner UNIMICRON TECH CORP