Electronic device housing and manufacturing method therefor

Abstract

The invention discloses an electronic device housing and a manufacturing method for the electronic device housing. The manufacturing method comprises the following steps: forming a metal antenna on the surface of an active plastic layer of the electronic device housing by an LDS (Laser Direct Structuring) technology; spraying a layer of bottom coating agent on the surface of the active plastic layer and the surface of the metal antenna; moulding a layer of liquid silica gel on the surface of the active plastic layer sprayed with the bottom coating agent and the surface of the metal antenna in an injection way, drying the liquid social gel to form a silica gel protective layer. According to the electronic device housing and the manufacturing method for the electronic device housing, the silica gel protective layer is moulded on the surface of the electronic device housing in an injection way by liquid silica gel, and can be suitable for various different using environments for the electronic device housing, can be manufactured to be very soft or relatively hard, and has high anti-tearing and anti-stretching strength; simultaneously, the product is diversified in colour, smudginess-resistant, chemical-resistant, and soft and smooth in hand feeling.

Description

technical field [0001] The present invention relates to an electronic equipment housing with a metal antenna formed by LDS technology and a manufacturing method thereof. The electronic device housing can be widely used in various electronic devices with wireless communication functions, such as mobile phones, computers, tablet computers and the like. Background technique [0002] Laser direct structuring (LDS) technology is a technology developed by German LPKF company, which has been widely used in the production process of mobile phone antennas. LDS technology uses a laser to carve antenna circuit traces on the surface of thermoplastic composite components, and activates the organometallic additives in this thermoplastic material by laser, exposing the metal particles in the organic metal additives, such as copper particles, to the components The surface of the circuit trace, and finally the laser-activated part of the component, that is, the surface of the circuit trace,...

AI Technical Summary

Problems solved by technology

Protecting the antenna with a protective cover will obviously increase the thickness of the mobile phone case, which will affect the appearance, and the protective cover is also easy to fall off, not firm, and if the thickness is too large, it will even affect the signal reception of the antenna

When spraying protective paint, the protective paint cannot be sprayed too thick at one time, and it is easy to fall off if it is too thick; too thin is not wear-resistant, and it is difficult to cover the antenna metal layer protruding from the surface of the shell

If you spray paint multiple times, you have to spray it again and polish it once. The process is complicated and the cost is high

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