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Contact probe and probe unit

A technology of contact probe and probe unit, which is applied in the direction of connection, electrical components, parts of connection devices, etc., can solve the problems of increased resistance and poor conductivity, so as to ensure flexibility, reliability and good conduction. general effect

Inactive Publication Date: 2012-11-14
NHK SPRING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the contact probe disclosed in Patent Document 1, in order to ensure elasticity, the contact probe itself must be lengthened, and there is a problem that the resistance increases and the conductivity deteriorates.

Method used

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  • Contact probe and probe unit
  • Contact probe and probe unit
  • Contact probe and probe unit

Examples

Experimental program
Comparison scheme
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Embodiment approach 1

[0040] figure 1 It is a perspective view showing the structure of the probe unit according to Embodiment 1 of the present invention. figure 1 The shown probe unit 1 is a device used when inspecting the electrical characteristics of a semiconductor integrated circuit 100 as an object to be inspected, and is a circuit that connects the semiconductor integrated circuit 100 and outputs inspection signals to the semiconductor integrated circuit 100. A device for electrical connection between substrates 30 . It should be noted that, in the first embodiment, the semiconductor integrated circuit 100 is described as a QFN (Quad Flat Non-leaded Package: Quad Flat Non-leaded Package) having the electrodes 101 .

[0041] The probe unit 1 has: a conductive contact probe 20 (hereinafter referred to as "probe 20" for short) which is in contact with the semiconductor integrated circuit 100 and the circuit board 30 as two different objects to be contacted; The probe holder 10 of the holding ...

Embodiment approach 2

[0067] In the first embodiment, the case where the second contact portion of the probe is not in contact with the wall surface of the fixing member is described, but in the second embodiment, the second contact portion is in contact with the wall surface of the fixing member. The situation will be explained. Figure 14 It is a perspective view which shows the structure of the probe 20f concerning Embodiment 2 of this invention. It should be noted that, for figure 1 The same constituent elements of the above-mentioned probe unit 1 in et al. are denoted by the same reference numerals.

[0068] Figure 14 The illustrated probe 20f has a substantially flat plate shape with a uniform thickness, has a side surface curved in an arc at the front end, and is connected with the side surface through the side surface. figure 1 The first contact portion 21 shown in contact with the semiconductor integrated circuit 100; has an arc-shaped curved side, and through the side and figure 1 Th...

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Abstract

A contact probe (20) having a substantially flat plate shape, used to connect different substrates and having a uniform plate thickness. The contact probe (20) is provided with: a first contact section (21) which has a side surface curved in an arc shape and which makes contact with one substrate at the side surface thereof; a second contact section (22) which has a side surface curved in an arc shape and which makes contact with the other substrate at the side surface thereof; a connection section (23) which connects the first contact section (21) and the second contact section (22); and an elastic section (24) which extends from the second contact section (22), has a portion curved in an arc shape, and is elastically deformed by a load applied to the first contact section (21) and the second contact section (22).

Description

technical field [0001] The present invention relates to a contact probe and a probe unit used for connection between electric circuit boards and the like. Background technique [0002] In the past, when conducting a conduction state inspection or operating characteristic inspection on an inspection object such as a semiconductor integrated circuit or a liquid crystal panel, in order to realize the electrical connection between the inspection object and the signal processing device that outputs the inspection signal, a plurality of conductive devices are used. The probe unit of the touch probe. In the probe unit, with the progress of high integration and miniaturization of semiconductor integrated circuits and liquid crystal panels in recent years, by narrowing the pitch between contact probes, the inspection object that has been highly integrated and miniaturized The technology that can also be applied in is advancing. [0003] As a technique for narrowing the pitch betwee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R1/073G01R31/26
CPCG01R1/0466H01R13/2435H01R13/2442G01R1/067
Inventor 茂木孝浩松井晓洋石川浩嗣
Owner NHK SPRING CO LTD