Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate

A water-based composition and chemical-mechanical technology, applied in the direction of polishing compositions containing abrasives, etc., can solve problems that need to be improved, achieve the effects of reducing surface defects and particle residues, improving polishing removal efficiency, and ensuring stability

Active Publication Date: 2014-04-23
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the composition and the chemical mechanical polishing process method that are currently used for titanium substrate polishing still need to be improved.

Method used

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  • Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate
  • Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate
  • Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Example 1 Influence of the change of polishing liquid and polishing pressure on the polishing effect during the initial polishing process

[0042] According to the conditions described in the following experimental groups and control groups, the initial polishing experiment of the titanium substrate was carried out respectively, and then the polishing effects of each group were compared:

[0043] 1. Grouping and processing methods

[0044] Experimental group 1:

[0045] Add 20 grams of 2-phosphonobutane-1,2,4-tricarboxylic acid, 10 grams of lactic acid (corrosion inhibitor film-forming agent), and 10 grams of ammonium fluoride (complexing agent) into 500 grams of deionized water in sequence, Stir to dissolve, and then stir slowly to add 187 grams of 30% 25nm silica hydrosol (abrasive).

[0046] Before polishing, add 60 grams of 30% oxidant hydrogen peroxide solution to the above mixture, and wash with H 2 SO 4 Calibrate its pH value to 3.0, and finally add water t...

Embodiment 2

[0064] Influence of the composition and pH value of the chemical mechanical polishing aqueous composition on the polishing effect in the process of embodiment 2 fine polishing

[0065] According to the conditions described in the following experimental groups and control groups, the titanium substrates after the initial polishing were respectively finely polished, and then the polishing effects of each group were compared:

[0066] 1. Grouping and processing methods

[0067] Experimental group 1:

[0068] Add 20 grams of 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA), 10 grams of lactic acid (LA) (corrosion inhibitor film-forming agent), and 10 grams of ammonium fluoride (complexing agent) in sequence 500 grams of deionized water, stir to dissolve, evenly stir slowly and add 187 grams of 30% 25nm silica hydrosol (abrasive).

[0069] Before polishing, add 60 grams of 30% oxidant hydrogen peroxide solution to the above mixture, and wash with H 2 SO 4 Calibrate its pH v...

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Abstract

The invention relates to a chemical mechanical polishing aqueous composite and a chemical mechanical polishing process of a titanium substrate. The chemical mechanical polishing aqueous composite comprises: 1-20wt%, preferably 4-6wt% of abrasive material, 0.5-10wt%, preferably 0.9-3wt% of oxidant, 0.01-10wt%, preferably 0.1-2wt% complexing agent, and 0.1-10wt%, preferably 1-5wt% corrosion-inhibition film forming agent, wherein a pH value of the chemical mechanical polishing aqueous composite is 1.0-7.0, preferably 1.5-4.0. The chemical mechanical polishing aqueous composite disclosed by the invention can be effectively applied to a chemical mechanical polishing process of the titanium substrate so as to be capable of effectively obtaining a polished titanium metal layer with high polishing speed and high surface quality.

Description

technical field [0001] The invention relates to a chemical mechanical polishing aqueous composition and a titanium substrate chemical mechanical polishing process. Background technique [0002] At present, the research on the chemical mechanical polishing (CMP) of titanium is mainly focused on the improvement of the polishing rate and the adjustment of the relative selectivity ratio of tungsten / copper / oxide, etc., while the surface quality of polished titanium such as polishing defects, surface Roughness etc. are rarely involved. However, as far as the current development trend is concerned, the manufacturing of next-generation high-tech electronic products requires a surface with high planarization, nano-scale surface roughness, extremely low microscopic defects, and extremely low particle adsorption, which is also an improvement for polished titanium metal. Higher requirements are put forward for permanent polishing composition and polishing process method, especially to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02C23F3/06
CPCC23F3/06
Inventor 路新春戴媛静潘国顺雒建斌
Owner TSINGHUA UNIV
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