Three-channel cooling structure of CPU (Central Processing Unit)

A cooling structure, three-channel technology, applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of unsuitable application occasions, small application scope, etc., and achieve the effect of small water pressure loss and short process.

Inactive Publication Date: 2012-11-28
WUXI FORMEN TECHN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.
However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its scope of application is small

Method used

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  • Three-channel cooling structure of CPU (Central Processing Unit)
  • Three-channel cooling structure of CPU (Central Processing Unit)
  • Three-channel cooling structure of CPU (Central Processing Unit)

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Embodiment Construction

[0009] See figure 1 , figure 2 , image 3 , which includes an upper cover plate 1, a micro-cutting cooling plate 2, the upper end surface of the upper cover plate 1 is provided with a water outlet 3, a water inlet 4, the upper cover plate 1 is mounted on the micro-cutting cooling plate 2, the upper cover plate 1, the micro-cutting cooling plate The cavity formed by cutting the cooling plate 2 is provided with a jet diverter plate 5, and the jet diverter plate 5 is provided with three parallel flow channel notches 6, the middle flow channel notch 6 is located directly below the water inlet 3, and the flow channel notches 6 on both sides are The flow channel notch 6 is located on both sides of the middle flow channel notch 6, the aperture of the water inlet 3 is larger than the width W of the middle flow channel notch 6, and the water inlet 4 is respectively connected to three outlets along the upper surface of the jet splitter plate 5. Parallel runner notch 6, the below of r...

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PUM

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Abstract

The invention provides a three-channel cooling structure of a CPU (Central Processing Unit), which can be used for reducing the temperature of a heating device to be lower than environmental temperature and adapted to various environmental occasions and has the advantages of large application range and no noise. The three-channel cooling structure comprises an upper cover plate and a microdissection cooling plate, wherein the upper end surface of the upper cover plate is provided with a water outlet and a water inlet, and the upper cover plate is covered on the microdissection cooling plate. The three-channel cooling structure is characterized in that a jet splitter plate is arranged in a cavity formed by the upper cover plate and the microdissection cooling plate; the jet splitter plate is provided with three parallel channel notches; the middle channel notch is positioned right below the water inlet, and the channel notches at both sides are positioned at both sides of the middle channel notch; and the hole diameter of the water inlet is larger than the width of the middle channel notch.

Description

technical field [0001] The invention relates to the technical field of computer CPU cooling, in particular to a three-channel cooling structure of the CPU. Background technique [0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying. However, in the existing water-cooling cooling method, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its applicable range is small. Contents of the invention [0003] In view of the above pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/473
Inventor 谈士权
Owner WUXI FORMEN TECHN
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