Efficient and low-cost hollow-out method for sapphire wafer bar

A sapphire crystal and sapphire technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems such as the inability of the coolant to reach a large amount, the complex tool clamping mechanism, and the poor chip removal effect, and achieve good chip removal. Effectiveness, optimal balance of chip evacuation and corrosion protection, cost reduction effect

CN102806609AInactive Publication Date: 2012-12-05四川欣蓝光电科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2012-12-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses an efficient and low-cost hollow-out method for a sapphire wafer bar. Problems that an existing method for hollowing out a bar is poor in chip removal effect and large quantities of cooling liquid cannot reach a bar hollowed-out portion are solved. The efficient and low-cost hollow-out method mainly includes steps of (1), fixing a sapphire crystal on a machine tool, and turning on a cooling water pipe to continuously feed cooling liquid into the sapphire crystal; and (2), moving a cutter to a position to be processed and forming the sapphire wafer bar by more than one processing cycle. Each processing cycle includes hollowing out the bar, lifting the cutter, removing chips and moving the cutter downwards. In the step of hollowing out the bar, the rotational speed of the cutter ranges from 300r / min to 500r / min, and the bar begins to be hollowed out; in the step of lifting the cutter, the cutter is quickly lifted up when the depth of a hollowed-out portion of the bar ranges from 2mm to 5mm; in the step of removing the chips, the rotational speed of the cutter is controlled to range from 500r / min to 1000r / min, and the rotational speed of the cutter is adjusted to range from 300r / mm to 500r / min after 3-6 seconds; and in the step of moving the cutter downwards, the cutter moves downwards to the position to be processed. The efficient and low-cost hollow-out method has the advantages of high efficiency, good chip removal effect and cooling effect, and the like.
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Description

technical field

[0001] The present invention relates to a method for removing a wafer rod, in particular to a method for removing a rod from a sapphire wafer with high efficiency and low cost. Background technique

[0002] The sapphire crystal has high hardness and high processing resistance. The large amount of heat generated by the tool grinding the crystal during rod removal will cause harm to the tool, and the adhesion of the generated grinding debris to the tool will also seriously affect the grinding performance of the tool.

[0003] In order to cool the tool and remove grinding debris, there are usually two processing methods for removing rods: water through the center of the rod removal tool and no water through the center.

[0004] The cooling problem can be better solved by adopting the method of passing water through the center of the cutting tool, but it has the following disadvantages: 1. It needs to use expensive CNC machining center equipment, 2. The tool clam...

Examples

Embodiment 1

[0033] A kind of high-efficiency and low-cost sapphire wafer rod method of the present invention is mainly made up of following steps:

[0034] (1) Fix the sapphire crystal on the machine tool, open the cooling water pipe and continuously introduce the cooling liquid.

[0035] In the present invention, the machine tool is selected as a CNC drilling and milling machine, which can realize the programming control of the following steps through the CNC drilling and milling machine, so as to realize full automation, and the cost can be effectively reduced through this selection.

[0036] The specific process of this step is as follows: figure 1 As shown, the sapphire crystal 1 is fixed on the glass spacer 3 of the machine tool through the T-shaped bolt 2, and the glass spacer 3 is fixed on the machine tool table 4, thereby effectively fixing the sapphire crystal 1 on the machine tool. The cooling water pipe 5 is opened to allow the cooling liquid to flow out of the cooling water p...

Embodiment 2

[0046] The difference between this embodiment and Embodiment 1 lies in that the rotating speeds of the cutters in each step are different. In the rod extraction step: the tool speed is adjusted to 300r / min; in the chip removal step: the tool speed is controlled at 500r / min, after 6s, the tool speed is adjusted to 300r / min.

[0047] In the pulling step of this embodiment: the depth of the rod is 2 mm; the concentration of the cooling liquid is 1.5%.

Embodiment 3

[0049] The difference between this embodiment and Embodiment 1 lies in that the rotating speeds of the cutters in each step are different. In the rod extraction step: the tool speed is adjusted to 500r / min; in the chip removal step: the tool speed is controlled at 1000r / min, after 3s, the tool speed is adjusted to 500r / min.

[0050] In the pulling step of this embodiment: the depth of the rod is 4mm; the concentration of the cooling liquid is 4.1%.

[0051] The rods of sapphire crystals can be pulled out through the above-mentioned embodiments, and the length of the rods pulled out can be greater than 250mm. At the same time, since the cutter diameter of the present invention ranges from 2 to 6 inches, the production of sapphire wafer rods with different diameters can be realized by replacing cutters with different diameters.

[0052] It is found by detection that the average production time of each sapphire wafer rod of the present invention is much less than the average pro...