Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof

A flexible copper clad laminate and double-sided technology, which is applied in the production field of the thermally conductive double-sided flexible copper clad laminate, can solve the problems of export and dissipation, low thermal conductivity, and large heat generation, so as to enhance thermal conductivity, improve thermal conductivity, reduce The effect of small thermal resistance

Active Publication Date: 2012-12-19
ALLSTAE TECH ZHONGSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the popularization and application of LEDs in a large area, and the development of high-function and high-power electronic chips, LEDs and electronic chips on electronic circuit substrates generate large amounts of heat, and traditional circuit board substrates have low thermal conductivity, which is not conducive to heat dissipation. , will lead to a decrease in the life of LEDs and electronic chips, and traditional circuit board substrates can no longer meet the requirements

Method used

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  • Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof
  • Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof
  • Heat-conductive two-sided flexible copper clad laminate and manufacturing method thereof

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no. 1 example

[0025] Such as figure 2 As shown, the second embodiment of the present invention is to add a second heat-conducting polyimide layer 4 between the heat-conducting adhesive layer 3 and the second copper foil 5, that is, press the other side of the heat-conducting adhesive layer 3 The second thermally conductive single-sided copper-clad laminate is coated with the second copper foil 5 and the second thermally conductive polyimide layer 4 coated thereon to form a second thermally conductive single-sided copper-clad laminate.

[0026] The first copper foil 1 is one of electrolytic copper foil and rolled copper foil, the second copper foil 5 is one of electrolytic copper foil and rolled copper foil, the first copper foil 1 and the second copper foil 5 The same, the thickness is 3~35um.

[0027] The first thermally conductive polyimide layer and the second thermally conductive polyimide layer are also the same, with a thickness of 3~25um, containing 1%~10% solid content of thermall...

Embodiment 1

[0049] Thermally conductive polyamic acid composition:

[0050] Dissolve 0.5 parts by weight of coupling agent, 0.5 parts by weight of dispersant, and 15 parts by weight of aluminum nitride in 300 parts by weight of NMP solvent, and add diaminodiphenyl ether (ODA for short) into the solution, so that the equivalent ratio of ODA to ODA is 0.997 Pyromellitic dianhydride (PMDA) was also added and dissolved, the total amount of ODA and PMDA accounted for 86 parts by weight, stirred at 20°C for 48 hours, and polymerized to obtain a polyamic acid composition;

[0051] Preparation of the first thermally conductive single-sided flexible copper clad laminate

[0052] The above-mentioned polyamic acid composition was coated on a 18um rolled copper foil with a coating thickness of 8um, baked at 180°C for 3 minutes, and then baked at 350°C for 10 minutes to obtain the first thermally conductive single-sided flexible copper clad laminate, for later use.

[0053] Thermally conductive adhe...

Embodiment 2

[0058] Thermally conductive polyamic acid composition:

[0059] Dissolve 1.0 parts by weight of coupling agent and 15 parts by weight of alumina in 300 parts by weight of NMP solvent, add diaminodiphenyl ether (ODA for short) to dissolve, and dissolve pyromellitic dianhydride with an equivalent ratio of 0.997 to ODA (PMDA) was also added and dissolved, the total amount of ODA and PMDA accounted for 86 parts by weight, stirred at 20°C for 48 hours, and polymerized to obtain a polyamic acid composition;

[0060] Preparation of the first thermally conductive single-sided flexible copper clad laminate

[0061] The above-mentioned polyamic acid composition was coated on a 18um rolled copper foil with a coating thickness of 10um, baked at 180°C for 3 minutes, and then baked at 350°C for 10 minutes to obtain the first thermally conductive single-sided flexible copper clad laminate, for later use.

[0062] Thermally conductive adhesive using modified acrylic composition

[0063] 30...

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Abstract

The invention discloses a heat-conductive two-sided flexible copper clad laminate and a manufacturing method thereof. The heat-conductive two-sided flexible copper clad laminate comprises a first copper foil, and a first heat-conductive polyimide layer; a heat-conductive adhesive layer is coated on the first heat-conductive polyimide layer, and a second copper foil is cladded on the heat-conductive adhesive layer; the manufacturing method comprises the following steps: preparing the first copper foil and the second copper foil, preparing a heat-conductive adhesive and heat-conductive polyamide acid; coating the heat-conductive polyamide acid composition on the first copper foil, performing high temperature imidization to obtain the first heat-conductive polyimide layer; coating a layer of the heat-conductive adhesive on the first heat-conductive polyimide layer, drying, pressing together with the second copper foil or a second heat-conductive one-sided flexible copper clad laminate, and curing. According to the invention, the flexible copper clad laminate has an increased coefficient of heat conductivity, reduced heat resistance, enhanced heat conductivity and heat dissipation capability, and enlarged application scope.

Description

[technical field] [0001] The invention relates to a heat-conducting double-sided flexible copper-clad laminate, and also relates to a manufacturing method of the heat-conducting double-sided flexible copper-clad laminate. [Background technique] [0002] The traditional manufacturing method of flexible copper clad laminates is three-layer adhesive type or two-layer adhesive-free type. The three-layer adhesive type is coated on one or both sides of a commercially available 8~50um polyimide film with a thickness of one layer. It is a modified epoxy resin or modified acrylic resin adhesive of 5~35um, which is obtained by laminating copper foil after drying; the two-layer non-adhesive type is coated with polyamic acid on the copper foil, and then imidized to obtain non-adhesive A single-sided copper-clad laminate is coated with a layer of thermoplastic polyimide, and then copper foil is laminated on the thermoplastic polyimide layer to obtain an adhesive-free double-sided copper-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B27/28B32B7/12B32B37/12B32B38/18
Inventor ZHANG JIAJIHUANG SUJIN
Owner ALLSTAE TECH ZHONGSHAN
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