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Rapid cooling and bonding device for plate pipe hot melt adhesive

A rapid cooling, hot melt adhesive technology, applied in the direction of adhesives, bonding methods, etc., can solve the problems of high labor intensity, low production efficiency, long operation time, etc. Effect

Inactive Publication Date: 2012-12-19
JIANGSU XINCHENG ELECTRICAL APPLIANCE GENERAL FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of device has a simple structure and is easy to implement, but because the water in the briquetting block with a cavity cannot circulate, the cooling is relatively slow; on the other hand, manual pressure is applied to the briquetting block with a cavity, and the labor intensity of the workers is high and the operation time is long. Low production efficiency

Method used

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  • Rapid cooling and bonding device for plate pipe hot melt adhesive
  • Rapid cooling and bonding device for plate pipe hot melt adhesive

Examples

Experimental program
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Effect test

Embodiment Construction

[0011] The present invention will be further described below according to the accompanying drawings and in conjunction with the embodiments.

[0012] The plate tube hot melt adhesive fast cooling bonding device shown in the accompanying drawings includes a cylinder assembly 1, a support assembly 2, a pressure block with a cavity 3 and a pump station 5; the support assembly 2 includes a support 2.3, which is fixedly connected to the support 2.3 The two guide posts 2.2 on the support plate, the top plate 2.1 fixedly connected to the upper end of the guide post 2.2, the cylinder of the cylinder assembly 1 is fixedly connected to the upper end surface of the top plate 2.1, and its piston rod passes through the hole on the top plate 2.1 and the pressure block with a cavity 3 connection; guide holes are provided on both sides of the pressure block 3 with a cavity, and the pressure block 3 with a cavity is set on the guide post 2.2 through two guide holes, and can slide up and dow...

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PUM

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Abstract

The invention discloses a rapid cooling and bonding device for a plate pipe hot melt adhesive, which comprises a cylinder assembly, a support assembly, a pressing block with a cavity and a pump station, wherein the support assembly comprises a support, two guide posts and a top plate; the cylinder of the cylinder assembly is fixedly connected with the upper end surface of the top plate, and the piston rod of the cylinder assembly penetrates through a hole on the top plate to be connected with the pressing block with the cavity; the pressing block with the cavity can slide up and down along the guide posts; and the pump station is connected with the pressing block with the cavity to form a circulatory cooling system. When the rapid cooling and bonding device is used, a plate pipe applied with the adhesive is placed on a support plate, the cylinder assembly is driven, the pressing block with the cavity is moved down to press the plate pipe applied with the adhesive and is in a pressure maintaining state, and the pressing block with the cavity cools the plate pipe applied with the adhesive; and because cooling water in the pressing block with the cavity is circulated, the cooling speed is high and cooling effect is good. The cylinder assembly drives the pressing block with the cavity to move up and down and applies pressure on the pressing block with the cavity, so that the operation is rapid and the labor intensity of workers is greatly alleviated.

Description

technical field [0001] The present invention relates to a cooling device, and more particularly, the present invention relates to a circulating cooling device under pressurization. Background technique [0002] The plate tube evaporator generally uses hot melt adhesive to bond the metal plate and the evaporator tube. When the hot melt adhesive is bonded, it needs to be glued at high temperature, and then the plate tube after the glue is pressed under a certain pressure. Cooling, so as to ensure the bonding effect of the metal plate and the evaporation tube after cooling. At present, the cooling of the plate tube under pressure after sizing is generally carried out on a special device. On the plate tube, the cavity in the press block with cavity is filled with cold water, and a certain pressure is manually applied to the press block with cavity, so that the plate tube is cooled under pressure, ensuring the metal plate and the evaporation tube after cooling. bonding effect. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/00
Inventor 王日华
Owner JIANGSU XINCHENG ELECTRICAL APPLIANCE GENERAL FACTORY