Manufacturing process for copper interconnection line
A manufacturing process and interconnection technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to achieve the effect of reducing etching steps, reducing manufacturing costs, and increasing production capacity
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[0031] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing:
[0032] Figures 3a-3i It is a schematic structural flow diagram of a manufacturing process of a copper interconnection wire of the present invention;
[0033] Such as Figures 3a-3i As shown, a manufacturing process of a copper interconnection in the present invention, first, deposit a low dielectric constant dielectric layer 32 on the upper surface of a silicon substrate 31, and coat the first photoresist 33 that can form a hard mask to cover the dielectric layer 32, after exposure and development, the excess photoresist is removed to form a first hard mask photoresist 331 with a metal groove structure 34; wherein, the material of the first photoresist 33 contains silane groups, silane oxides Base or clathrate siloxane, etc.
[0034] Secondly, in the same developing station, coating liquid silylation material 35 such as hexamethyldisilazane, t...
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