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Information processing equipment

A technology for information processing equipment and shells, applied in the direction of electrical digital data processing, digital data processing parts, instruments, etc., can solve the problems of damaged hardware equipment, limited heat dissipation area, and damage to main components, etc., to achieve extended service life and long life The effect of battery life and good sealing

Active Publication Date: 2013-01-09
江苏瑞仕达电气设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these notebook products usually follow the traditional hardware layout design, so they have not overcome the criticisms that have existed since the birth of notebook computers, such as:
[0003] 1. Poor heat dissipation performance: the central processing unit, display chip, memory and other hardware are placed under the panel where the keyboard is located along with the motherboard. Since they are the main heat source, and the heat dissipation area that they can expose to the outside is very limited, the heat dissipation of heat dissipation by means of the radiator is very limited. The ports are generally distributed on the bottom or side, and the heat dissipation at the bottom is easily blocked by the desktop where the computer is placed, which can easily cause poor heat dissipation and damage hardware devices
[0004] 2. Discomfort caused by high temperature: When used for a long time, the above-mentioned main heat sources will cause high temperature in the keyboard and its surroundings, which will cause discomfort to the user's hands; at the same time, the high temperature of the cooling vent will also affect the surrounding objects; When used on the legs, it will bring extreme discomfort to the legs due to the high temperature
[0005] 3. Poor waterproof and dustproof performance: As for the layout of the main components mentioned above, water and dust can easily enter the interior through the gaps in the keyboard and the cooling vents and cause damage to the main components
[0006] 4. Short battery life: Because the layout of the above-mentioned main components is in the base where the keyboard is located, the space left for the power supply components is limited, so the battery life of the product is also limited to a large extent.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0034] Such as figure 1 and figure 2 As shown, an information processing device such as a notebook computer includes a first casing 1 , a second casing 2 and a connecting part 3 . For example, the first housing 1 accommodates computing components and display components, and the second housing 2 accommodates input components and power supply components. In addition, the connecting part 3 connects the first casing 1 and the second casing 2 .

[0035] The first casing 1 may have a cubic space surrounded by multiple surfaces (surfaces of the casing) (the back surface may be an arcuate surface), and accommodate the computing components and display components of the information processing device in the space. The computing components include hardware components such as motherboard components, processor components, radiator components, display output components (also known as display drive circuits) and memory components in the first casing. The display section displays an image ...

Embodiment 2

[0047] Embodiment 2 is the same as Embodiment 1, the difference is that the setting positions of the memory are different, such as Figure 4 As shown, hardware devices such as a motherboard, a central processing unit, a display output assembly, and a heat sink assembly are arranged in the first housing 1 . For example, according to one embodiment of the present invention, the rear end surface of the first housing 1 can be a metal back cover and provide heat dissipation as a radiator such as a heat sink, and the metal back cover can be a combination of aluminum alloy and copper . In the lower half of the space, a motherboard can be arranged, and hardware devices such as a central processing unit, a display output component such as a graphics card, and a memory (not shown) are arranged on the motherboard. The central processing unit can be a CULV processor (consumer ultra-low voltage processor), or the central processing unit and display output components such as a graphics car...

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PUM

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Abstract

The invention discloses information processing equipment. The information processing equipment comprises a first shell body, a second shell body and a connecting component, wherein the first shell body contains an operation component and a display component, and the second shell body contains an input component and a power supply component; the connecting component is used for connecting the first shell body with the second shell body and enabling the first shell body to rotate relative to the second shell body; a storage component is further arranged in the first shell body or second shell body; and the storage component is also called as a memory and consists of at least one of hard disk, flash memory and optical drive. According to the information processing equipment, the heat dissipation capability and duration capability of a whole hardware system are improved through more optimized and reasonable layout configuration.

Description

technical field [0001] The present invention relates to an information processing device. Background technique [0002] With the development of science and technology and the improvement of working and living conditions, computer products have gradually integrated into people's daily life, study and work. Notebook computer is more subject to liking of numerous users because of portability. In recent years, the research and development of small-size, low-power, high-performance processors (such as CULV processors) and the technology of storage devices such as solid-state drives (SSDs) have become more and more perfect, allowing many manufacturers to launch thinner and lighter notebook products. However, these notebook products usually follow the traditional hardware layout design, so they have not overcome the criticisms that have existed since the birth of notebook computers, such as: [0003] 1. Poor heat dissipation performance: hardware such as the central processing un...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/20
Inventor 曾斌
Owner 江苏瑞仕达电气设备有限公司
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