Method and device for mass production of printed circuit boards
A printed circuit board, mass production technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve the problems of low production efficiency, high production cost, and many production processes, and achieve the production process The effect of fewer processes, improved production efficiency, and reduced production costs
Inactive Publication Date: 2015-08-19
HISENSE VISUAL TECH CO LTD
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Problems solved by technology
[0012] It can be seen from the above that in the existing method of inserting printed circuit boards, the main and auxiliary printed circuit boards are produced independently, which makes the production cost relatively high; furthermore, the insertion of printed circuit boards requires two independent placements , two times of machine insertion, and two times of wave soldering. Therefore, the production process of plugging the main printed circuit board A and the auxiliary printed circuit board B into a printed circuit board is a serial production process, and there are many production processes, which makes the production less efficient
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[0056] The technical solutions of the various embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0057] In the existing method of batch production of printed circuit boards, the main and auxiliary printed circuit boards are produced independently, which makes the production cost higher; the serial production process flow is adopted, which makes the production process flow more and the production efficiency is lower.
[0058] In the embodiment of the present invention, a production process in which the main and auxiliary printed circuit boards are designed as one is considered, a...
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The invention discloses a method and a device for batch production of printed circuit boards. Main printed circuit boards and secondary printed circuit boards which are designed together in advance are produced in a whole board manner, so as to form N batches of whole boards; the secondary printed circuit boards which are carried out fixation processing and board separation processing in the ith batch of whole boards are inserted into the main printed circuit boards of the i+1 batch of whole boards, wherein i is the serial number of the batch, is a natural number and is less than N; the i+1 batch of whole boards into which the ith batch of secondary printed circuit boards are carried out fixation processing and board separation processing, so as to obtain the main printed circuit boards as integrated main printed circuit boards of the i+1 batch of whole boards, and as secondary printed circuit boards of the i+2 batch. Applying the invention, production cost can be reduced, and production efficeitncy can be promoted.
Description
technical field [0001] The invention relates to printed circuit board technology, in particular to a method and device for batch production of printed circuit boards. Background technique [0002] With the wide application of semiconductor devices, in order to realize the assembly of electronic components in electronic equipment, electronic components are widely mounted on the main and auxiliary printed circuit boards (PCB), that is, the main and auxiliary printed circuit boards are mounted, Machine plugging, wave soldering and other processes, and then the main and auxiliary printed circuit boards that have been patched, machine plugged, and wave soldered are plugged in and fixed to generate an integrated printed circuit board, such as a TV The core board in the computer and the main board of the computer are all formed by plugging independent main and auxiliary printed circuit boards. Since the circuits and components that make up the main and auxiliary printed circuit bo...
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IPC IPC(8): H05K3/00H05K3/36H05K3/34
Inventor 任国扬于卫勇
Owner HISENSE VISUAL TECH CO LTD