Heat treating equipment and method for semiconductor chip
A technology for heat treatment equipment and semiconductors, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as the inability to accurately measure the oxygen content of the reaction chamber and the inability to ensure the production quality of silicon wafers, and achieve the goal of ensuring production quality. Effect
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[0028] The specific embodiments of the present invention will be described in further detail below in conjunction with the drawings and embodiments. The following examples are used to illustrate the present invention, but not to limit the scope of the present invention.
[0029] figure 1 It is a schematic diagram of the structure of a semiconductor wafer heat treatment equipment according to an embodiment of the present invention, see figure 1 , The heat treatment equipment includes: a heater 1, a process tube 2, a sealing plate 3, an intake pipe 4, an exhaust pipe 5, a gas collection unit 6 and an oxygen content measurement unit 7, and the nozzle of the process tube 2 is vertically downward The process tube 2 is partially placed in the heater 1, and a flange 8 is provided at the outer edge of the nozzle of the process tube 2 (the process tube 2 and the flange 8 can be integrally formed or processed separately. In the embodiment, preferably, the process pipe 2 and the flange 8 ar...
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