Multi-channel compound heat radiating sealing chassis

Abstract

The invention relates to a multi-channel compound heat radiating sealing chassis which is characterized in that outer sealing plates are arranged on two sides of a chassis frame, an upper cover plate and a lower cover plate are arranged on and under the chassis frame, two ends of the chassis frame are provided with a front panel and a rear sealing plate, a fan is arranged on the rear sealing plate, a connector frame is arranged inside the chassis frame, a separation plate for separating a strong current region and a weak current region is arranged on the connector frame, a side wall heat radiating fin is arranged on the connector frame in the strong current region, an installing plate is arranged on one side of the weak current region, which is positioned on the rear sealing plate, an inner fan is arranged on the installing plate, an inner separation plate is arranged between the inner fan and the rear sealing plate, heat radiating fins are arranged on two ends of the inner separating plate; and two side surface heat exchange plates are arranged on two sides of the chassis frame and positioned between the chassis frame and the outer sealing plates. According to the invention, by adopting a method of combining conduction with secondary forced heat radiation, the problem of heat radiation of a high-density and large-power sealing electronic device can be effectively solved.

Description

technical field [0001] The invention belongs to the three technical fields of machinery, heat and electromagnetics, and relates to a multi-channel composite sealed case used in an electronic case, and an electronic device with good airtightness and electromagnetic shielding function. Background technique [0002] Chassis are widely used in electronic equipment. Traditional chassis mainly rely on conduction heat dissipation: internal modules conduct heat to the chassis shell through structures such as locking strips or thermal pads, and the outside of the chassis takes heat away through natural convection or forced convection, and the chassis acts as a heat exchanger. The problem is that the contact thermal resistance is large and the heat conduction efficiency is not high. At present, electronic equipment is developing towards high density, high power, and miniaturization. The unit heat flux value in electronic equipment is increasing, and the temperature is getting higher ...

AI Technical Summary

Problems solved by technology

[0004] In order to avoid the deficiencies of the prior art, the present invention proposes a multi-channel composite sealed enclosure for electronic enclosures, which is a solution to the problems of large thermal resistance and poor heat dissipation performance of existing electronic equipment during conduction and heat dissipation. Applied to military and civilian product fields that require high sealing, electromagnetic shielding and heat dissipation of electronic equipment

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