Unlock instant, AI-driven research and patent intelligence for your innovation.

Laser dicing method

一种激光切割、激光束的技术，应用在激光焊接设备、玻璃切割装置、焊接/焊接/切割物品等方向，能够解决切割的工序增大等问题，达到优良割断特性的效果

Active Publication Date: 2015-05-13
TOSHIBA MASCH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there is a problem that the process for cutting increases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser dicing method
  • Laser dicing method
  • Laser dicing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0141] Laser cutting was performed under the following conditions by the method described in the embodiment.

[0142] Processed substrate: sapphire substrate, substrate thickness 100μm

[0143] Laser light source: Nd:YVO 4 laser

[0144] Wavelength: 532nm

[0145] Irradiation energy: 50mW

[0146] Laser frequency: 20KHz

[0147] Irradiation light pulse number (P1): 1

[0148] Number of non-irradiated light pulses (P2): 2

[0149] Table speed: 25mm / sec

[0150] Processing point depth: about 25.2 μm from the surface of the processed substrate

[0151] Figure 8 It is a figure which shows the irradiation pattern of Example 1. As shown in the figure, after one light pulse is irradiated, two light pulses, which are the light pulse unit, are not irradiated. This condition is described below as irradiation / non-irradiation=1 / 2. In addition, the irradiation / non-irradiation interval here is equal to the spot diameter.

[0152] In the case of Example 1, the spot diameter was ...

Embodiment 2

[0156] Laser cutting was performed in the same manner as in Example 1 except that irradiation / non-irradiation=1 / 1 was used. Figure 9B Results of laser cutting are shown. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

Embodiment 3

[0158] Laser cutting was performed in the same manner as in Example 1 except that irradiation / non-irradiation=2 / 2 was used. Figure 9C Results of laser cutting are shown. The upper side is an optical photograph of the upper surface of the substrate, and the lower side is an optical photograph of the upper surface of the substrate at a lower magnification than the upper side.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
frequencyaaaaaaaaaa
frequencyaaaaaaaaaa
Login to View More

Abstract

A laser dicing method for a substrate to be processed having a metal film on a surface thereof includes a metal film removing step for placing the substrate to be processed on a stage, irradiating the metal film with a defocused pulse laser beam, and removing the metal film, and a crack forming step for irradiating a region where the metal film is removed of the substrate to be processed with a pulse laser beam, and forming a crack in the substrate to be processed.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from Japanese Patent Application No. 2011-164041 filed on July 27, 2011, the entire content of which is incorporated by reference. technical field [0003] The present invention relates to a laser cutting method using a pulsed laser beam. Background technique [0004] Japanese Patent No. 3867107 discloses a method of using a pulsed laser beam for cutting a semiconductor substrate. In the method of Patent Document 1, a crack region is formed inside the object to be processed by optical damage caused by a pulsed laser beam. Then, the object to be processed is cut from the crack region as a starting point. [0005] In the prior art, the energy of the pulsed laser beam, the diameter of the spot, and the relative moving speed between the pulsed laser beam and the object to be processed are used as parameters to control the formation of the crack region. [0006] In additio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/38B23K26/36B23K26/40B28D5/00C03B33/09H01L21/301
CPCB23K26/0006B23K26/53B23K2103/56B23K26/382H01L21/30
Inventor 井出光广林诚佐藤庄一
Owner TOSHIBA MASCH CO LTD