Micro-electro-mechanical sensor chip and manufacturing method thereof
A teletype and acoustic device technology, applied in the field of microphones, can solve the problems of low sensitivity, complicated process, and the stress of the diaphragm cannot be released to the greatest extent, and achieves improved sensitivity, simple circuit design, enhanced hanging strength and shock-resistant drop strength. Effect
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[0039] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0040] figure 1 It is a schematic plan view of the conductive layer distribution of a micro-electromechanical microphone chip in an embodiment of the present invention. figure 2 It is a kind of microelectromechanical microphone chip in the embodiment of the present invention. figure 1 Sectional view of the dotted line in CD. image 3 It is a kind of microelectromechanical microphone chip in the embodiment of the present invention. figure 1 Sectional view of the dotted line AB.
[0041] see Figure 1-3 , the microelectromechanical microphone chip in the embodiment of the present invention includes: a substrate 1, a barrier layer 2, a support layer 3, a back plate, a diaphragm 6, a rivet 13, a first metal electrode 7 and a second me...
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