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Micro-electro-mechanical sensor chip and manufacturing method thereof

A teletype and acoustic device technology, applied in the field of microphones, can solve the problems of low sensitivity, complicated process, and the stress of the diaphragm cannot be released to the greatest extent, and achieves improved sensitivity, simple circuit design, enhanced hanging strength and shock-resistant drop strength. Effect

Active Publication Date: 2013-02-13
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a micro-electromechanical microphone chip and its manufacturing method to solve the above-mentioned problems that the stress of the diaphragm cannot be released to the greatest extent, the sensitivity is low, and the process is complicated

Method used

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  • Micro-electro-mechanical sensor chip and manufacturing method thereof
  • Micro-electro-mechanical sensor chip and manufacturing method thereof
  • Micro-electro-mechanical sensor chip and manufacturing method thereof

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Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0040] figure 1 It is a schematic plan view of the conductive layer distribution of a micro-electromechanical microphone chip in an embodiment of the present invention. figure 2 It is a kind of microelectromechanical microphone chip in the embodiment of the present invention. figure 1 Sectional view of the dotted line in CD. image 3 It is a kind of microelectromechanical microphone chip in the embodiment of the present invention. figure 1 Sectional view of the dotted line AB.

[0041] see Figure 1-3 , the microelectromechanical microphone chip in the embodiment of the present invention includes: a substrate 1, a barrier layer 2, a support layer 3, a back plate, a diaphragm 6, a rivet 13, a first metal electrode 7 and a second me...

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Abstract

The invention discloses a micro-electro-mechanical sensor chip and a manufacturing method thereof. The micro-electro-mechanical sensor chip adopts the structure that the upper surface of a substrate is a barrier layer, a supporting layer is positioned on the barrier layer, a back pole plate is positioned on the supporting layer; and a through hole is formed in the centers of the substrate, the barrier layer and the supporting layer to form a back cavity; the back pole plate is formed by an insulating layer and a conducting layer, wherein the insulating layer is positioned above the conducting layer; and the conducting layer is divided into two parts, one part of the conducting layer is positioned below the insulating layer and is subjected to fractal treatment in the back cavity to form cantilevers, vibration films are suspended on the cantilevers, rivets are arranged below the vibration films, which corresponds to the cantilevers, and the other part of the conducting layer is arranged below the insulating layer which corresponds to vibrating regions of the vibration films, and below the insulating layer, which corresponds to a first metal electrode and a second metal electrode. The technical scheme disclosed by the invention can solve the problems that the stresses of the vibration films cannot be released to the greatest extent, the sensitivity is low and the process is complex, and strengthens the shock-proof falling intensities of the suspended vibration films.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a micro-electromechanical microphone chip and a manufacturing method thereof. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS, Micro-Electro-Mechanical Systems), also known as micro-machines or micro-systems, refers to mass-produced micro-mechanisms, micro-sensors, micro-actuators, and signal processing and control circuits, until interfaces, Communication and power equal one tiny device or system. [0003] A microphone, also known as a microphone, is an energy conversion device that converts sound signals into electrical signals. [0004] At present, with the high-performance requirements of portable electronic products such as mobile phones and notebook computers, the performance requirements of electronic components such as microphones (microphones) inside electronic products are more stringent. Microelectromechanical microphone chips have been widel...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R31/00
Inventor 蔡孟锦
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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