Grain coating method and grain coating system for diamond wire saws

Abstract

The invention discloses a grain coating method and a grain coating system for diamond wire saws. The grain coating method includes firstly, coating resin binders uniformly on surfaces of wire cores; secondly, applying negative charge to diamond grains, applying positive charge to the wire cores, enabling the diamond grains with the negative charge to move under action of electric field stress so as to implant the diamond grains into the resin binders on the core wires; and thirdly, curing the wire cores. In the grain coating method, the diamond grains with negative charge are implanted into the resin binders on the surface of the wire cores under action of the electric field stress so as to be uniformly distributed in the resin binders on the surfaces of the wire cores; implanted depth of the diamond grains in the resin binders is controlled by controlling the electric field stress of the diamond particles, the exposure rate of the diamond grains is then controlled, and accordingly cutting precision and cutting efficiency of diamond wire saws can be guaranteed and service lives thereof can be prolonged.

Description

technical field [0001] The invention relates to the technical field of cutting technology, and more specifically, to a diamond wire saw sand planting method and system. Background technique [0002] As a cutting tool with better cutting effect, diamond wire saw is favored because of its narrow kerf, high material yield, ability to cut large-sized workpieces, no ablation marks on the cutting surface, less environmental pollution, and high cutting precision. Widely used in the cutting of high-hardness materials, especially in the process of cutting crystalline silicon into silicon wafers. [0003] A common preparation method of diamond wire saw is the resin binder method, which is prepared by using a resin binder to bond diamond particles to the metal core wire by sand planting. The sand planting method determines the distribution uniformity, distribution density, and edge height (exposed rate of diamond particles) of diamond particles on the diamond wire saw, which in turn d...

AI Technical Summary

Problems solved by technology

Since the space of the box body 41 is relatively large compared to the diameter of the core wire, this determines that most of the diamond particles embedded in the resin layer on the surface of the core wire are embedded after multiple collisions with the inner wall of the box body 41 or the diamond particles. The resin layer, so the speed of the diamond particles when embedded in the resin layer is different, and because the collision process is random, this leads to uneven distribution of the diamond particles on the surface of the core wire, and also causes the embedding depth of the diamond particles to be different. Some even have insufficient adhesion due to the shallow embedding depth, and may fall off during the cutting process, thus affecting the cutting force, cutting accuracy, cutting efficiency and service life of the diamond wire saw.

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