Semiconductor device
A semiconductor and chip technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problem of low heat resistance reliability, and achieve the effect of improving heat resistance reliability
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no. 1 Embodiment approach
[0026] Below, refer to Figure 1 ~ Figure 3 , The first embodiment will be described. Such as figure 1 As shown, the semiconductor device 1 has: a PGA (Pin Grid Array) type wiring board 10; a first semiconductor chip (first chip) 21 and a second semiconductor chip (second chip) 22, and these chips are mounted on the On the wire substrate 10; the heat sink 30 is arranged on the first chip 21. In the illustrated example, the first chip 21 and the second chip 22 are arranged in a horizontal direction (also referred to as a planar structure). Here, the first chip 21 is a logic chip with high thermal resistance and a large amount of heat generation, and the second chip 22 is a memory chip with lower thermal resistance than the first chip 21 and is not heat resistant. The second chip 22 is a semiconductor chip, and its calorific value is smaller than that of the first chip 21. As the logic chip, for example, a CPU (Central Processing Unit) chip or a GPU (Graphics Processing Unit) ...
no. 2 Embodiment approach
[0052] Hereinafter, the second embodiment will be described with reference to FIG. 6. Right and before Figure 1 ~ Figure 5 The same parts as shown are denoted by the same symbols, and detailed descriptions of the above-mentioned elements are omitted.
[0053] As shown in FIG. 6(a), the semiconductor device 2 has: a PGA (Pin Grid Array) type wiring board 10; a first chip 21 and a second chip 22, and these chips are mounted in a planar arrangement. The wiring board 10; the heat dissipation plate 30 is arranged on the first chip 21; the heat dissipation plate 40 is arranged on the second chip 22; and the heat insulating resin 41 is arranged between the heat dissipation plates 30 and 40.
[0054] The upper surface of the first chip 21 is thermally coupled to the bottom surface 33A of the recess 33 of the heat dissipation plate 30 (first heat dissipation plate) via the thermal interface material 25. The heat sink 30 has an opening 30X whose planar shape is larger than the planar shap...
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