Thermosetting resin composition and use thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of poor thermal stability and heat and humidity resistance, deterioration of heat and humidity resistance, limited improvement, etc.

Active Publication Date: 2013-03-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the copper-clad laminate composition uses cyanate resin and styrene maleic anhydride and its derivatives to improve the glass transition temperature of the epoxy resin system and has excellent high-frequency dielectric properties, but the system used There are acid anhydride groups in the molecular structure of the styrene-maleic anhydride copolymer, which can generate carboxyl groups with poor thermal stability and heat an

Method used

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  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof
  • Thermosetting resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Use 20.5 parts of SMA3000 styrene maleic anhydride copolymer, 12 parts of active ester, 32.5 parts of N695, 15 parts of BT93 (ethylene bis-tetrabromophthalimide), 20 parts of SC2050MB and supplemented with catalyst 2-MI ( 2-Methylimidazole), use MEK (butanone) to dissolve the above compound, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of SMA, active ester, N695, BT93 and SC2050MB is 100 parts.

[0091] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80~120 degrees, the heating rate is controlled at 1.0~3.0 degrees / minute; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep...

Embodiment 2

[0093] Use 7.5 parts of EF602, 5 parts of active ester, 32.5 parts of HP7200, 15 parts of BT93, 20 parts of SC2050MB supplemented with catalyst 2-MI, use MEK to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of EF60, active ester, HP7200, BT93 and SC2050MB is 100 parts.

[0094] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80~120℃, the heating rate is controlled at 1.0~3.0 degrees / minute; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature for 90 minutes. The corresponding properties are shown in Table 1.

Embodiment 3

[0096] Use 5 parts of SMAEF605, 27.5 parts of active ester, 32.5 parts of HP7200, 15 parts of BT93, 20 parts of SC2050MB supplemented with catalyst 2-MI, use MEK to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the mass parts of EF60, active ester, HP7200, BT93 and SC2050MB is 100 parts.

[0097] Eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil are stacked together and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature for 90 minutes. The corresponding properties are shown in Table 1.

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Abstract

The invention discloses a thermosetting resin composition which comprises epoxy resins except brominated epoxy resin, an styrene maleic anhydride copolymer and an additive flame retardant, and further comprises an active ester. The thermosetting resin composition can be used for preparing resin sheet materials, resin compound metal copper foils, prepregs, laminates, copper clad laminates, printed circuit boards, etc. The thermosetting resin composition substantially reduces probability of delamination of PCB substrate, overcomes disadvantages of deterioration of system dielectric properties due to introduction of tetrabromobisphenol A, and has advantages of good heat stability and heat and humidity resistance, low dielectric constant and dielectric loss tangent, and good flame resistance.

Description

technical field [0001] The present invention relates to a kind of resin composition, specifically, the present invention relates to a kind of thermosetting resin composition and its application in resin sheet, resin composite metal foil, prepreg, laminated board, metal foil clad laminated board and printed circuit board in the application. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit and process large-capacity information at high speed, the operating signal tends to be high-frequency, so the circuit substrate is moving towards high-layer, high- The development of wiring density puts forward new requirements for the substrate materials used. These requirements include: 1. Good dielectric properties (that is, low dielectric constant and low dielectric loss factor), and can be used in a wide range of It remains stable under te...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/42B32B15/092B32B27/06B32B27/18
CPCC08L2312/00C08L35/06C08L63/00
Inventor 苏民社陈勇唐国坊杨中强
Owner GUANGDONG SHENGYI SCI TECH
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