Thermosetting resin composition and application thereof

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problem of inability to meet the requirements of high-frequency signals, low dielectric loss tangent, and insufficient high-frequency characteristics and other problems, to achieve the effect of good toughness, low dielectric loss tangent, and improved thermal stability.

Active Publication Date: 2014-04-23
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the first aspect of the embodiment of the present invention provides a thermosetting resin composition, which has good thermal stability and heat and humidity resistance, good toughness, adhesion and flame retardancy, and a dielectric constant and The dielectric loss tangent is low, which is used to solve the problem of high dielectric constant and dielectric loss tangent of epoxy resin circuit substrates made of epoxy resin-based adhesives in the prior art, poor stability, and poor high-frequency characteristics. Sufficient, unable to adapt to the high frequency requirements of the signal

Method used

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  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] Use 20.5 parts of SMA3000 styrene maleic anhydride copolymer, 12 parts of HF-10, 22.5 parts of DER530, 14 parts of NC-3000, 11 parts of BT93 (ethylene bis tetrabromophthalimide), 20 parts of SC2050MB and Supplemented with catalyst 2-MI (2-methylimidazole) and zinc octoate, the above compounds are dissolved in MEK (butanone) and prepared into a glue with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SMA, HF-10, DER530, BT93, NC-3000 and SC2050MB is 100 parts.

[0105] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure is set at 20kg / cm...

Embodiment 2

[0107]Use 30 parts of EF60, 5 parts of HF-10, 35 parts of DER530, 10 parts of HP4700, 20 parts of SC2050MB, supplemented with catalyst 2-MI, zinc naphthenate, use MEK to dissolve the above compounds, and prepare a glue with a suitable viscosity . Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the parts by weight of EF60, HF-10, DER530, HP-4700, and SC2050MB is 100 parts.

[0108] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

Embodiment 3

[0110] Using 10 parts of SMA EF60, 8 parts of SMA3000, 22.5 parts of HF-10, 32.5 parts of DER530, 7 parts of NC-3000, 20 parts of SC2050MB, supplemented with catalyst 2-MI, zinc naphthenate, using MEK to dissolve the above compounds, And adjust the glue with suitable viscosity. Use 2116-type electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain a B-stage prepreg sample. The sum of the parts by weight of SMA EF60, SMA3000, HF-10, DER530, NC-3000, SC2050MB and Z-TECH is 100 parts.

[0111] Eight pieces of prepreg prepared above and two pieces of one-ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

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Abstract

The invention provides a thermosetting resin composition, comprising bromized epoxy resin, biphenyl-type and/or naphthalene-type epoxy resin, styrene-maleic anhydride copolymer and cyanate ester resin, wherein the bromine element content in a molecular structure of the bromized epoxy resin is 36-60% based on weight content; the weight of the bromine element in the bromized epoxy resin is 10-23% of total weight of the thermosetting resin composition. The thermosetting resin composition has good heat stability and humidity resistance, good tenacity, adhesive force and fire resistance, and low dielectric constant and dielectric loss angle tangent. The embodiment of the invention also provides application of the thermosetting resin composition in a resin sheet, a resin composite metal foil, a prepreg, a laminated plate, a coated metal foil pressure plate and a printed circuit board.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal foil-clad laminates and printed circuit boards . Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit high-speed and process large-capacity information, the operating signal tends to be high-frequency, so new materials for circuit substrates are proposed. Requirements, these requirements include: 1. Good dielectric properties (that is, low dielectric constant and low dielectric loss factor), and can remain stable under a wide range of temperature and frequency conditions; 2. Can withstand PCB processing Acid-base, high-temperature and high-humidity environment shocks will not cause moisture absorption and expansion...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L35/06C08L79/04C08G59/42C08G59/40B32B15/092B32B27/04H05K1/03
Inventor 苏民社
Owner HONOR DEVICE CO LTD
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