Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of thermosetting resin composition and use thereof

A resin composition and thermosetting technology, applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of moisture and heat resistance degradation, plate delamination explosion, thermal stability and moisture resistance. Waiting for a question

Active Publication Date: 2015-09-16
GUANGDONG SHENGYI SCI TECH
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the copper-clad laminate composition uses cyanate resin and styrene maleic anhydride and its derivatives to improve the glass transition temperature of the epoxy resin system and has excellent high-frequency dielectric properties, but the system used There are acid anhydride groups in the molecular structure of the styrene-maleic anhydride copolymer, which can generate carboxyl groups with poor thermal stability and heat and humidity resistance; Used together, it will further deteriorate the heat and humidity resistance
Although the resistance to heat and humidity has been improved to a certain extent by adding epoxy resin, the improvement is limited and cannot be fundamentally eliminated. In this way, during the PCB manufacturing process, the board is easily corroded by moisture and delaminated and exploded, and the product is qualified. very low rate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of thermosetting resin composition and use thereof
  • A kind of thermosetting resin composition and use thereof
  • A kind of thermosetting resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Use 20.5 parts of SMA3000 styrene maleic anhydride copolymer, 12 parts of active ester, 32.5 parts of N695, 15 parts of BT93 (ethylene bistetrabromophthalimide), 20 parts of SC2050MB and catalyst 2-MI ( 2-Methyl imidazole), use MEK (butanone) to dissolve the above compound and prepare it into a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain B-stage prepreg samples. The sum of the mass parts of the SMA, active ester, N695, BT93 and SC2050MB is 100 parts.

[0091] Laminate eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil together, and laminate them by a hot press to obtain a double-sided copper clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120 degrees, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set to 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature f...

Embodiment 2

[0093] Use EF6027.5 parts, 5 parts active ester, 32.5 parts HP7200, 15 parts BT93, 20 parts SC2050MB and catalyst 2-MI, use MEK to dissolve the above compounds, and prepare a suitable viscosity glue. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain B-stage prepreg samples. The sum of the mass parts of EF60, active ester, HP7200, BT93 and SC2050MB is 100 parts.

[0094] Laminate eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil together, and laminate them by a hot press to obtain a double-sided copper clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80~120℃, the heating rate is controlled at 1.0~3.0 degrees / minute; 2. The pressure is set to 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature for 90 minutes. The corresponding performance is shown in Table 1.

Embodiment 3

[0096] Use 605 parts of SMAEF, 27.5 parts of active ester, 32.5 parts of HP7200, 15 parts of BT93, 20 parts of SC2050MB, supplemented by catalyst 2-MI, use MEK to dissolve the above compounds, and prepare a glue of suitable viscosity. Use 2116 electronic grade glass cloth to soak the glue, and remove the solvent in an oven at 155°C to obtain B-stage prepreg samples. The sum of the mass parts of EF60, active ester, HP7200, BT93 and SC2050MB is 100 parts.

[0097] Laminate eight pieces of prepreg and two pieces of one-ounce electrolytic copper foil together, and laminate them by a hot press to obtain a double-sided copper clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120℃, the heating rate is controlled at 1.0-3.0 degrees / minute; 2. The pressure is set to 20kg / cm 2 ; 3. The curing temperature is 190 ℃, and keep this temperature for 90 minutes. The corresponding performance is shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.

Description

Technical field [0001] The present invention relates to a resin composition, in particular, the present invention relates to a thermosetting resin composition and its application in resin sheets, resin composite metal foils, prepregs, laminates, metal-clad laminates and printed circuit boards In the application. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of computers and information communication equipment, in order to transmit and process large-capacity information at a high speed, the operating signal tends to increase in frequency. The development of wiring density has put forward new requirements for the substrate materials used. These requirements include: 1. Good dielectric properties (ie low dielectric constant and low dielectric loss factors), and can be used in a wide range of It remains stable under temperature and frequency conditions; 2. It can withstand the impact of the acid-base, high ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/42B32B15/092B32B27/06B32B27/18
CPCC08L35/06C08L2312/00C08L63/00
Inventor 苏民社陈勇唐国坊杨中强
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com