Circuit board mark detection and offset detection method and arrangement method

Abstract

The invention provides a circuit board mark detection and offset detection method and an arrangement method, the detection method comprises the following steps: at least a circuit board is provided and is composed of a plurality of daughter boards, wherein positioning targets are provided on the circuit board and the daughter boards; a detection apparatus is provided, the detection apparatus at least comprises a slip module, an image acquisition unit and an operation unit, the image acquisition unit is used for acquiring the positioning targets on the circuit board and the images of the positioning targets on the daughter boards; and the operation unit is used for analyzing the images of the positioning targets, then the relative offset of each daughter board and the circuit board can be calculated according to the positioning targets. According to the invention, the operation unit of the detection apparatus is used for analyzing the images by a high speed operation mode of software, and the invention has better detection rate and can greatly increase the performance of a production line.

Description

technical field [0001] The invention relates to a method for detecting a mark and an offset amount and a component placement method thereof, in particular to a method for detecting a mark and an offset amount of a circuit board and a component placement method thereof. Background technique [0002] The existing circuit board is a large-area motherboard, such as a motherboard in a computer system. However, as electronic devices such as PDAs, mobile phones or digital cameras become smaller and smaller, the volume of the circuit substrate is also reduced. For the consideration of production efficiency, the industry combines multiple small circuit boards (also called sub-boards) into one large circuit board (also called multi-connection board) to facilitate subsequent mass production processes. [0003] However, because the multiple small circuit boards mentioned above may not meet the specifications for electrical continuity (ie, open circuit, short circuit, etc.) due to proces...

AI Technical Summary

Problems solved by technology

[0005] One of the objectives of the present invention is to use an independent detection device to capture and analyze the image of the circuit board in a relatively short period of time to determine whether there is a defective product mark on the sub-board of the multi-connected board , and analyze the position of the positioning target to calculate the offset of the sub-board, and then transmit the detection information and offset of the multiple sub-boards to the downstream machine such as the pick-and-place machine, and the pick-and-place machine can use the detection The known information and offset can be used to carry out the placement operation, so that the production speed of the placement production line can be greatly improved, so it can solve the problem that the traditional use of pick-and-place machines for detection of defective sub-boards or detection of sub-board offsets can lead to quite long idle time problem

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