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Substrate processing apparatus

A substrate processing device and substrate technology, which are applied to the surface coating liquid device, transportation and packaging, textiles and papermaking, etc., can solve the problems of reducing the processing capacity of the substrate, and cannot handle multiple substrates, so as to improve the processing capacity , keep clean effect

Inactive Publication Date: 2013-03-13
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, since a plurality of substrates cannot be conveyed to each processing section at the same time, the throughput of substrate processing may be reduced.

Method used

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  • Substrate processing apparatus
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Experimental program
Comparison scheme
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no. 1 approach ＞

[0084] figure 1 It is a schematic plan view of the substrate processing apparatus 100 of the first embodiment. The substrate processing apparatus 100 is configured as an apparatus for processing various substrates (hereinafter, simply referred to as “substrates”) 9 After coating various processing liquids such as a resist liquid, the substrate 9 is dried to form a thin film on the surface of the substrate 9 . In addition, in this embodiment, the substrate 9 is rectangular (including square), but the shape is not limited thereto, and may be other shapes such as circular (including elliptical), for example.

[0085] Such as figure 1 As shown, the substrate processing apparatus 100 has a substrate receiving unit 1 , a coating unit 2 , a drying unit 3 , a substrate delivery unit 4 , transport mechanisms 5 , 6 , and 7 , and a control unit 8 . In addition, in figure 1 In each of the drawings and subsequent figures, in order to clarify the directional relationship of the above-me...

no. 2 approach ＞

[0125] Image 6 It is a schematic plan view of 100 A of substrate processing apparatuses of 2nd Embodiment. In addition, in the following description, the same code|symbol is attached|subjected to the member which has the same function as 1st Embodiment, and description is abbreviate|omitted.

[0126] The substrate processing apparatus 100A has a substrate receiving unit 1A, a substrate delivery unit 4A, and a transport mechanism 5A. Also in the substrate processing apparatus 100A, as in the substrate processing apparatus 100 of the first embodiment, the two substrates 9 , 9 are simultaneously conveyed to the coating unit 2 , the drying unit 3 , and the like. However, it is different from the substrate processing apparatus 100 in that one conveying mechanism 5A is used to carry the substrate to the coating section 2 or the drying section 3. In addition, the substrate receiving section 1A, the coating section 1A, and the substrate are set in accordance with the conveying metho...

no. 3 approach ＞

[0152] Figure 9 It is a schematic plan view of a substrate processing apparatus 100B of the third embodiment. The substrate processing apparatus 100B has one transport mechanism 5B that simultaneously transports two substrates 9 , 9 , and a substrate receiving unit 1B, a coating unit 2B, and a drying unit 3B are arranged around the transport mechanism 5B. In this point, the substrate processing apparatus 100B is similar to the substrate processing apparatus 100A of the second embodiment. However, the transport mechanism 5B has a plurality of support members 511B longer than the support member 511 . The transport mechanism 5B holds and transports the two substrates 9 , 9 in a state where the two substrates 9 , 9 are aligned in the extending direction of the supporting member 511B.

[0153] In addition, the substrate receiving unit 1B, the coating unit 2B, and the drying unit 3B are configured so that the substrates 9 , 9 can be placed in accordance with the arrangement of th...

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Abstract

The substrate processing apparatus (100) has a substrate acceptance portion (1) which receives a substrate (9) from the exterior. An application portion (2) applies a process liquid to the substrate. A conveyance system includes the conveyance mechanisms (5-7) which convey simultaneously the several substrates in the substrate acceptance portion to the application portion. A dryer portion (3) dries the substrate applied with the process liquid. A nozzle (21) discharges the process liquid from an ejection opening extended in one direction.

Description

technical field [0001] The present invention relates to a substrate processing device for processing a substrate. Background technique [0002] Conventionally, there is known a substrate processing apparatus for applying a processing liquid such as a resist to a color filter or a semiconductor wafer. [0003] In such a substrate processing apparatus, it has been proposed to install a plurality of coating devices or a plurality of drying devices in order to increase the throughput of the substrate processing (for example, Patent Document 1 and Patent Document 2). [0004] More specifically, Patent Document 1 discloses a substrate processing apparatus in which a plurality of rotary system units for applying a processing liquid are arranged side by side along the conveyance path of the conveyance device, A plurality of heat-type units for drying substrates with processing liquids are arranged in multi-layer stacks. In addition, Patent Document 2 discloses a coating device inc...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/67B05C5/00B05C13/02D05B3/00
CPCB05C13/02B65G49/061H01L21/0273H01L21/67706H01L21/67718H01L21/67745
Inventor 高木善则池田文彦
Owner DAINIPPON SCREEN MTG CO LTD
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