Light emitting diode (LED) light source with cooling device

Abstract

The invention discloses a light emitting diode (LED) light source which comprises a cooling device, an LED chip and an electrode layer. The cooling device is composed of a base plate, a first transitional layer and a diamond-like carbon layer, the first transitional layer is adhered between the base plate and the diamond-like carbon layer, adhesive force which is produced among the first transitional layer, the base plate and the diamond-like carbon layer is greater than that of the base plate and the diamond-like carbon layer when the base plate and the diamond-like carbon layer are mutually attached, a coefficient of thermal expansion of the first transitional layer is between that of the diamond-like carbon layer and the base plate, and the LED chip is arranged on the diamond-like carbon layer and electrically connected to the electrode layer. By the mode, the diamond-like carbon layer and a metal base plate of the LED light source are combined well, and service life of the LED light source can be prolonged.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to an LED light source with a heat dissipation device. Background technique [0002] Because light-emitting diodes have the advantages of low power consumption, low heat generation, and long life; therefore, in the fields of electronic display and lighting, light-emitting diodes are gradually replacing traditional lighting fixtures with high energy consumption and short life. [0003] When LED light sources perform their intended work, they typically generate a lot of heat; this heat needs to be dissipated. If the heat cannot be effectively dissipated, it will affect the normal operation of the LED light source. [0004] DLC (Diamond-like carbon, diamond-like carbon) coating not only has good thermal conductivity, but also has the same thermal conductivity in all directions, so it is widely used in light-emitting diode light sources for heat dissipation. [0005] A conventional light emit...

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Problems solved by technology

[0006] However, the thermal expansion coefficients of the metal substrate and the diamond-like layer are several times different. When the heat generated by the light-emitting chip is dissipated through the heat-dissipating substrate, the diamond-like layer is easily peeled off from the metal substrate, which leads to the failure of the LED light source.

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