Light emitting diode (LED) light source with cooling device

A technology of LED light source and heat dissipation device, applied in the field of LED light source, can solve the problems of diamond-like carbon layer peeling, failure of light emitting diode light source, etc., and achieve the effects of good combination, improvement of thermal mismatch problem, and prolongation of service life.

Active Publication Date: 2013-03-20
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the thermal expansion coefficients of the metal substrate and the diamond-like layer are several times different. When the heat generated by the light-emitting chip is dissipated through the heat-dissipating substrate, the diamond-like layer is easily peeled off from the metal substrate, which leads to the failure of the LED light source.

Method used

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  • Light emitting diode (LED) light source with cooling device
  • Light emitting diode (LED) light source with cooling device
  • Light emitting diode (LED) light source with cooling device

Examples

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Embodiment Construction

[0026] refer to figure 1 According to the first embodiment of the present invention, the LED light source 100 includes a heat sink 10 , an LED chip 11 , an electrode layer 12 and a transition layer 13 . The heat sink 10 includes a substrate 101 , a transition layer 102 and a diamond-like carbon (DLC, Diamond-like carbon) layer 103 . The LED chip is disposed on the diamond-like carbon layer 103 , and the electrode layer 12 is also disposed on the diamond-like carbon layer 103 ; and the LED chip 11 is electrically connected to the electrode layer 12 through wires (not shown). In this embodiment, the LED chips 11 are LED chips with a horizontal structure.

[0027] The substrate 101 is substantially plate-shaped. The substrate 101 can be selected from materials with better thermal conductivity, such as metal, ceramics, or plastics with high thermal conductivity. The transition layer 102 is attached between the substrate 101 and the diamond-like carbon layer 103, and the adhesio...

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Abstract

The invention discloses a light emitting diode (LED) light source which comprises a cooling device, an LED chip and an electrode layer. The cooling device is composed of a base plate, a first transitional layer and a diamond-like carbon layer, the first transitional layer is adhered between the base plate and the diamond-like carbon layer, adhesive force which is produced among the first transitional layer, the base plate and the diamond-like carbon layer is greater than that of the base plate and the diamond-like carbon layer when the base plate and the diamond-like carbon layer are mutually attached, a coefficient of thermal expansion of the first transitional layer is between that of the diamond-like carbon layer and the base plate, and the LED chip is arranged on the diamond-like carbon layer and electrically connected to the electrode layer. By the mode, the diamond-like carbon layer and a metal base plate of the LED light source are combined well, and service life of the LED light source can be prolonged.

Description

technical field [0001] The invention relates to a semiconductor device, in particular to an LED light source with a heat dissipation device. Background technique [0002] Because light-emitting diodes have the advantages of low power consumption, low heat generation, and long life; therefore, in the fields of electronic display and lighting, light-emitting diodes are gradually replacing traditional lighting fixtures with high energy consumption and short life. [0003] When LED light sources perform their intended work, they typically generate a lot of heat; this heat needs to be dissipated. If the heat cannot be effectively dissipated, it will affect the normal operation of the LED light source. [0004] DLC (Diamond-like carbon, diamond-like carbon) coating not only has good thermal conductivity, but also has the same thermal conductivity in all directions, so it is widely used in light-emitting diode light sources for heat dissipation. [0005] A conventional light emit...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/64F21V29/00F21Y101/02F21V29/70F21V29/85F21Y115/10
CPCH01L2224/48091H01L2224/48137H01L2224/49107H01L2924/00014
Inventor 柴广跃徐健刘文李倩珊冯丹华廖世东许文钦胡永恒章锐华熊龙杰
Owner SHENZHEN UNIV
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