High-frequency module and high-frequency device using the same

Abstract

The invention provides a high-frequency module and a high-frequency device using the same, in which no switch connector is needed and by which the reduction of production cost is easy to realize. On a circuit board (2) of the high-frequency module (1), an RF circuit (3) and an antenna element (4) are arranged, and transmission lines between both the RF circuit (3) and the antenna element (4) are provided. The transmission line (7) of the RF circuit (3) side among the transmission lines is led-out from the top of the circuit board (2) to a rear surface (2a) side of the circuit board (2) through a via hole (8), and the transmission line (9) of the antenna element (4) side is led-out from the top of the circuit board (2) to the rear surface (2a) side through another via hole (10). Electrical continuity between tip portions (7a, 9a) of the transmission lines (7, 9) is blocked off on the rear surface (2a) of the circuit board (2); however, when the high-frequency module (1) is mounted on the motherboard (20), a bridging connection land (22) is soldered to each of the tip portions (7a, 9a), so that the transmission lines (7, 9) are connected with each other.

Description

technical field [0001] The present invention relates to a high-frequency module having an RF circuit and an antenna element suitable for wireless communication, etc., and a high-frequency device constructed by mounting such a high-frequency module on a motherboard. Background technique [0002] In recent years, high-frequency equipment (wireless communication) capable of wireless communication or broadcast signal reception can be performed by surface-mounting a high-frequency module composed of an RF circuit and an antenna element on a circuit board on the motherboard of various portable terminals. devices or broadcast signal receivers) are gaining popularity. Generally, such a high-frequency module performs characteristic measurement in order to evaluate or adjust the performance of the RF circuit at the assembly stage, and after confirming the desired performance of the RF circuit, the circuit board of the high-frequency module is mounted on a predetermined area on the mot...

AI Technical Summary

Problems solved by technology

Therefore, in the case of a high-frequency module having a switch connector on the transmission line between the RF circuit and the antenna element as disclosed in Patent Document 1, there is a problem that the cost of components increases, making it difficult to reduce production costs.

[0013] On the other hand, in the high-frequency module disclosed in Patent Document 2, although an inexpensive coaxial connector is used, additional mounting is required to bridge the transmission line on the RF circuit side and the transmission line on the antenna element side. Working on chip parts or performing soldering work using a soldering iron, etc.

In other words, even if the cost of parts is suppressed, the number of assembly man-hours increases, and as a result, it is difficult to reduce the production cost of the high-frequency module with such a structure.

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