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Electronic component

一种电子部件、电连接的技术，应用在电气元件、器件零部件、电路等方向，能够解决电子部件特性劣化等问题

Active Publication Date: 2013-03-27
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the top plate (metal top plate) formed of metal above the functional part is grounded, the characteristics of the electronic parts deteriorate

Method used

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Experimental program
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Effect test

no. 1 approach

[0033] The first embodiment is an embodiment in which the metal top plate is electrically connected to the signal wiring. The structure of the ladder filter according to the first embodiment will now be described. Figure 5 A and B among them are plan views showing the ladder filter according to the first embodiment. omitted with figure 2 An instantiation of the corresponding floor plan, since this floor plan is related to figure 2 Same, just different number of terminals. Figure 6A to Figure 6C is a sectional view showing the ladder filter according to the first embodiment. Figure 6A is along Figure 5 The cross-sectional view of the fold line A-A in B, Figure 6B is along Figure 5 A cross-sectional view of line B-B in B, while Figure 6C is along Figure 5 Section view of the fold line C-C in B. Figure 7 is a diagram showing a duplexer including the ladder filter according to the first embodiment. The transmit filter of the duplexer 101 is a ladder-type filte...

no. 2 approach

[0047] The second embodiment is an embodiment in which the metal top plate 20 is divided. Figure 9A with Figure 9B is a plan view showing the ladder filter according to the second embodiment. to omit Figure 5 Middle A to Figure 6C A description of the structure that has been described previously in . Such as Figure 9A with Figure 9B As shown, in the ladder-type filter 200 according to the second embodiment, each metal top plate 20 is located above a corresponding one of the resonators. Other structures are the same as those of the ladder filter 100 according to the first embodiment.

[0048] A simulation of frequency characteristics in a ladder filter will now be described. In the simulation, frequency characteristics were compared between the second embodiment and the second comparative example. The second comparative example is an example in which the metal top plate is grounded. The structure of the ladder filter according to the second comparative example wi...

no. 3 approach

[0057] The third embodiment is an example of a module including electronic components. Figure 15A is a sectional view showing a module according to the third embodiment. Figure 15A The cross section of the ladder filter 100 in is along the Figure 6B Intercepted by line C-C in.

[0058] Such as Figure 15A As shown, a module 300 according to the third embodiment includes a ladder filter 100 , a printed circuit board 70 and a molding resin 76 . The printed circuit board 70 is made of resin, for example, and includes wiring 72 . The multilayer printed circuit boards 70 are stacked together, and the wirings 72 are electrically connected to each other through the wirings 74 . Ladder filter 100 is electrically connected to wiring 72 through solder balls. As described above, the ladder filter 100 is flip-chip mounted on the printed circuit board 70 . A molding resin 76 that seals the filter ladder 100 is located on the printed circuit board 70 in the uppermost layer. Accord...

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Abstract

An electronic component includes: a substrate; a functional element located on the substrate; a wiring located on the substrate and electrically connected to the functional element; a metal ceiling located above the functional element so that a space is formed between the metal ceiling and the functional element; and a sealing portion located on the metal ceiling, wherein the metal ceiling is electrically connected to a signal wiring that is included in the wiring and transmits a high-frequency signal.

Description

technical field [0001] A certain aspect of the invention relates to electronic components. Background technique [0002] Acoustic wave devices are used as filters, duplexers, and the like included in wireless communication terminals. As an acoustic wave resonator, there are a surface acoustic wave (surface acoustic wave: SAW) resonator using a surface acoustic wave, a boundary acoustic wave resonator using a boundary wave, a film bulk acoustic resonator (FilmBulkAcousticResonator: FBAR) using a piezoelectric film, and the like. As a functional part that excites acoustic waves, for example, in a surface acoustic wave device, it is an electrode such as an IDT (Interdigital Transducer: Interdigital Transducer), and in an FBAR, it is a region where a plurality of electrodes interpose a piezoelectric thin film. In an acoustic wave device, in order to efficiently excite sound waves, a void is sometimes formed above the acoustic wave element. [0003] For example, Japanese Patent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/17H10N30/00H10N30/88H10N30/80
CPCH03H9/1071H05K7/02H01L41/053H01L41/04H03H9/6483
Inventor 松田隆志井上和则
Owner TAIYO YUDEN KK
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