Tiny hole cleaning method

Abstract

The invention discloses a tiny hole cleaning method. Plasma is generated through a laser shock target material; a tiny hole is arranged in a plasma plume; the included angle between a connecting line of a laser shock point and a tiny hole axis as well as an incident laser direction is 30-60 degrees; the length of the plasma plume is larger than the length of the tiny hole, and the width of the plasma plume is larger than the width of the tiny hole. With the adoption of the tiny hole cleaning method, the tiny hole is cleaned by adopting a manner that the plasma plume is shocked by a laser, so that secondary pollution generated by a cleaning agent can be avoided, and the tiny hole cleaning method can play a role on the surface of an inner wall of the tiny hole and cannot corrode the inner part of the tiny hole, therefore impurities and surface oxidation can be effectively removed.

Description

technical field

[0001] The invention belongs to the field of laser cleaning, and in particular relates to cleaning the inner wall of micropores. Background technique

[0002] In recent years, micro-vias have been widely used in various industrial products, especially the rapid growth in the use of electronic industrial products. The functional reliability of these industrial products depends largely on the quality of the microhole filling and metallization. Because when the micropores are exposed to the air environment, or during the manufacturing process, pollution is inevitable, and corrosion is also a problem that has not been solved for a long time. Before filling or metallization, pretreatment of the inner wall surface of the micropore must be carried out.

[0003] At present, most of the micro through-holes are treated by chemical cleaning methods. The invention patents with patent numbers of 201120211318.6, 200710051536.6, 200910105193.6, and 200510041106.7 a...

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